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High-initial-adhesion-strength moisture-curable polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive and moisture-curing technology, which is applied in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of lower production efficiency, long holding time, and low initial adhesion of PUR hot-melt adhesives And other issues

Inactive Publication Date: 2020-10-30
SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional PUR hot melt adhesive has low initial adhesion, which requires a longer holding time and more holding fixtures in the manufacturing process of electronic devices, which greatly reduces production efficiency.

Method used

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  • High-initial-adhesion-strength moisture-curable polyurethane hot melt adhesive and preparation method thereof
  • High-initial-adhesion-strength moisture-curable polyurethane hot melt adhesive and preparation method thereof

Examples

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Effect test

preparation example Construction

[0023] The preparation method of reactive polyurethane hot melt adhesive follows the steps below:

[0024] Step 1: Put polyether polyol, polyester polyol, acrylic resin, antioxidant and tackifying resin into the reaction kettle according to the metering ratio, heat to 120°C, and vacuum (vacuum degree -0.09Mpa~-0.1Mpa) Stir and dehydrate for 2h;

[0025] Step 2: Cool down to 70°C, add diphenylmethane diisocyanate under nitrogen protection, slowly raise the temperature to 95°C, and stir for 2 hours under nitrogen protection;

[0026] Step 3: Add bismorpholino diethyl ether under the protection of nitrogen, stir and react at 95°C for 15 minutes, vacuum defoam, seal and store to prepare a polyurethane hot melt adhesive.

Embodiment 1

[0028] 270g of polyether polyol, 210g of a mixture of polydodecanoic acid-1,6-hexanediol ester diol and polyadipate-1,6-hexanediol ester diol, 107g of liquid polyester polyol, hydroxyl Add 250g of acrylic resin, 30g of tackifying resin and 1.9g of antioxidant into the reaction kettle, heat to 120°C, vacuumize (vacuum degree -0.09Mpa~-0.1Mpa) and stir and dehydrate for 2h; cool down to 70°C, add di 130g of phenylmethane diisocyanate, slowly heated up to 95°C, stirred and reacted for 2h under the protection of nitrogen; added 2g of catalyst bismorpholino diethyl ether under the protection of nitrogen, stirred and reacted at 95°C for 15min, vacuum defoamed, sealed and stored, prepared Obtain polyurethane hot melt adhesive.

Embodiment 2

[0030] 270g of polyether polyol, 210g of polysebacate-1,6-hexanediol and polyadipate-1,6-hexanediol mixture, 107g of liquid polyester polyol, and 250g of acrylic resin , Add 30g of tackifying resin and 1.9g of antioxidant into the reaction kettle, heat to 120°C, vacuumize (vacuum degree -0.09Mpa~-0.1Mpa) and stir and dehydrate for 2h; cool down to 70°C, add diphenylmethane under nitrogen protection 127g of diisocyanate, slowly heated up to 95°C, stirred and reacted for 2h under the protection of nitrogen; under the protection of nitrogen, 2g of catalyst bismorpholino diethyl ether was added, stirred and reacted at 95°C for 15min, vacuum defoamed, sealed and stored, and the polyurethane thermal Melt glue.

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PUM

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Abstract

The invention discloses a high-initial-adhesion-strength moisture-curable polyurethane hot melt adhesive and a preparation method thereof. The adhesive is prepared from the following raw materials inparts by weight: 20-50 parts of polyether polyol, 10-40 parts of crystalline polyester polyol, 5-30 parts of liquid polyester polyol, 10-20 parts of polyisocyanate, 10-35 parts of thermoplastic acrylic resin, 2-15 parts of tackifying resin, 0.1-0.5 parts of a catalyst and 0.1-1 part of an antioxidant. The moisture-curable polyurethane hot melt adhesive provided by the invention has the advantagesof long opening time, high initial adhesion strength, high curing speed, higher final adhesion strength, favorable damp-heat resistance and favorable high / low-temperature impact resistance, and can achieve the goals of no pressure maintaining and high-efficiency production of electronic products.

Description

technical field [0001] The invention belongs to the field of reactive polyurethane hot-melt adhesives, and relates to a high initial adhesive strength reactive polyurethane hot-melt adhesive for rapid assembly of electronic products. Background technique [0002] Reactive moisture-curing polyurethane hot melt adhesive (PUR for short), 100% solid content, solvent-free, is an environmentally friendly adhesive with fast positioning, and has been widely used in home appliances, handheld electronic devices, woodworking, textiles and automobiles in recent years interior and other fields. PUR is solid at room temperature, and melts into a liquid state after heating, which is applied to the bonding of substrates. When the adhesive cools and becomes solid, the polyurethane prepolymer provides initial strength due to cooling crystallization and physical crosslinking. Next, the isocyanate further reacts with the surface of the substrate and the moisture in the air to form a chemical ...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J175/06C08G18/48C08G18/42C08G18/62
CPCC08G18/4018C08G18/4063C08G18/4202C08G18/4238C08G18/4825C08G18/4833C08G18/4837C08G18/4854C08G18/6229C08G2170/20C09J175/06C09J175/08
Inventor 薛兵李俊杰李日辉
Owner SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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