Packaging method of high-temperature thermistor as well as packaged resistor and application thereof
A packaging method and the technology of sensitive resistors, which are applied in the electronic field, can solve the problems that the detection, protection, and control cannot be satisfied, the moisture-proof performance of epoxy materials is not superior, and the thermistor head is easily damaged, and achieve short cycle times and high electrical performance. Stable, low-cost results
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0046] a. Dry the high temperature resistant ceramic powder at 120°C for 12 hours for later use;
[0047] b. Insulate the deionized water at 80°C for later use;
[0048] c. Mix 5 g of ceramic powder obtained in step a with 20 mL of deionized water obtained in step b, and stir clockwise for at least 30 minutes to prepare a slurry to obtain a ceramic slurry;
[0049] d. Put the slurry obtained in step c into the cavity 1 of the drip plate, and adjust the liquid level of the slurry in the cavity according to the size of the head 2 of the high-temperature thermistor chip to be sealed until the slurry completely submerges the chip of the thermistor the head is appropriate;
[0050] e. Fix the end of the high-temperature thermistor platinum-rhodium lead wire 3 with a clamp 4, so that the head of the chip extends into the bottom of the slurry obtained in step d in the vertical direction of the drip plate, and then slowly takes it out in the opposite direction until it leaves the slu...
Embodiment 2
[0056] a. Dry the high temperature resistant ceramic powder at 120°C for 12 hours for later use;
[0057] b. Insulate the deionized water at 80°C for later use;
[0058] c. Mix 5 g of ceramic powder obtained in step a with 20 mL of deionized water obtained in step b, and stir clockwise for at least 30 minutes to prepare a slurry to obtain a ceramic slurry;
[0059] d. Put the slurry obtained in step c into the cavity 1 of the drip plate, and adjust the liquid level of the slurry in the cavity according to the size of the head 2 of the high-temperature thermistor chip to be sealed until the slurry completely submerges the chip of the thermistor the head is appropriate;
[0060] e. Fix the end of the high-temperature thermistor platinum-rhodium lead wire 3 with a clamp 4, so that the head of the chip extends into the bottom of the slurry obtained in step d in the vertical direction of the drip plate, and then slowly takes it out in the opposite direction until it leaves the slu...
Embodiment 3
[0065] a. Dry the high temperature resistant ceramic powder at 120°C for 12 hours for later use;
[0066] b. Insulate the deionized water at 80°C for later use;
[0067] c. Mix 5 g of ceramic powder obtained in step a with 20 mL of deionized water obtained in step b, and stir clockwise for at least 30 minutes to prepare a slurry to obtain a ceramic slurry;
[0068] d. Put the slurry obtained in step c into the cavity 1 of the drip plate, and adjust the liquid level of the slurry in the cavity according to the size of the chip head (2) of the high-temperature thermistor to be sealed until the slurry completely submerges the thermistor The chip head is suitable;
[0069] e. Fix the end of the high-temperature thermistor platinum-rhodium lead wire 3 with a clamp 4, so that the head of the chip extends into the bottom of the slurry obtained in step d in the vertical direction of the drip plate, and then slowly takes it out in the opposite direction until it leaves the slurry surf...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More