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Sealing composition

A technology for sealing and composition, applied in synthetic resin layered products, other chemical processes, chemical instruments and methods, etc., can solve problems such as weak moisture resistance

Pending Publication Date: 2020-10-30
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, organic EL elements have weak resistance to moisture, and it is necessary to block the interior of the element from moisture in the outside air.

Method used

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  • Sealing composition
  • Sealing composition
  • Sealing composition

Examples

Experimental program
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Effect test

Embodiment

[0197] The present invention will be described in more detail by showing examples below, but the present invention is not limited by these examples. In addition, in the following description, unless otherwise specified, "part" and "%" in the quantity of a component and a copolymerization unit represent "mass part" and "mass %", respectively.

[0198] The raw materials used in Examples and Comparative Examples are as follows,

[0199] (A) Polyolefin resin or polyolefin rubber

[0200] ・065 (manufactured by JSR Corporation): Butyl rubber (isobutylene-isoprene copolymer)

[0201] ・N50SF (manufactured by BASF Corporation): polyisobutylene (number average molecular weight: 400,000)

[0202] ・ER850 (manufactured by Starlight PMC): Glycidyl methacrylate (GMA) modified butyl rubber (epoxy group concentration: 0.64 mmol / g, number average molecular weight: 110,000) in 20% toluene solution

[0203] ・ER641 (manufactured by Starlight PMC): 35% toluene solution of maleic anhydride (MA)-m...

Embodiment 2

[0234] Add 20 parts of Ipzole 100 to 3 parts of butyl rubber (065), stir for 3 hours, disperse 1 part of alkyl aluminum diisopropyl acetoacetate (Aluminum Chelate M) and 20 parts of semi-calcined hydrotalcite ( DHT-4C), a mixture was obtained. To the obtained mixture was added the whole amount of a dissolved product obtained by adding 226.6 parts of toluene to 37 parts of butyl rubber (065) and stirring for 3 hours, and further blended 100 parts of glycidyl methacrylate modified butyl rubber ( ER850, 20% toluene solution), and 86 parts of maleic anhydride modified butyl rubber (ER641, 35% toluene solution), 1 part of antioxidant (Irganox 1010) and 9 parts of toluene, 0.2 parts of amine curing agent (TAP) , and the obtained mixture was uniformly dispersed with a high-speed rotary mixer to obtain a varnish (varnish 2) of the composition.

Embodiment 3

[0236] Instead of butyl rubber (065), use polyisobutylene (Oppanol N50SF), change 20 parts of semi-calcined hydrotalcite (DHT-4C) to 15 parts, and replace 1 part of alkyl aluminum diisopropyl acetoacetate (Aluminum Chelate M) A varnish (varnish 3) of the composition was obtained in the same manner as varnish 2 (Example 2) except that 1 part of diisopropoxybis(ethoxyacetoacetyl)titanium (TC710) was added.

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Abstract

Provided is a sealing composition that comprises components (A) to (C): (A) a polyolefin resin and / or a polyolefin rubber; (B) an inorganic filler; and (C) a metal complex wherein a bidentate ligand in which both of the two ligand atoms are oxygen atoms and a monodentate ligand in which the ligand atom is an oxygen atom are bonded to a center metal.

Description

technical field [0001] The present invention relates to a composition for sealing, and specifically relates to a composition for sealing suitable for sealing of electronic components and the like in flexible electronic devices. Background technique [0002] An organic EL element is a light-emitting element using an organic substance as a light-emitting material, and has attracted attention in recent years because it can obtain high-intensity light emission at a low voltage. However, the organic EL element has weak resistance to moisture, and it is necessary to block the inside of the element from moisture in the outside air. Therefore, it is possible to seal the organic EL element by forming a sealing layer from the composition so as to cover the entire surface of the light emitting layer formed on the substrate. A tackifying resin may be used in such a sealing composition because good adhesiveness to a substrate on which an element is formed is required. For example, Pate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/00B32B27/18B32B27/20B32B27/32C08K3/013C08K5/04C09K3/10H01L51/50H05B33/02H05B33/04
CPCB32B27/18B32B27/20B32B27/32C08K3/013C08K5/04C08L23/00C09K3/10H05B33/02H05B33/04H10K59/8722C08K5/56C08K9/04C08L23/22C08L23/26
Inventor 名取直辉户村文弥山本有希增山学大桥贤
Owner AJINOMOTO CO INC