Objective table of laser cutting equipment

Abstract

The embodiment of the invention belongs to the technical field of laser cutting equipment, and relates to an objective table of the laser cutting equipment. According to the technical scheme, the objective table comprises a supporting plate, a material receiving mechanism, an adsorption positioning mechanism and a driving mechanism; the adsorption positioning mechanism is arranged on the supporting plate, the adsorption positioning mechanism adsorbs a product and positions the product on the horizontal plane, the material receiving mechanism is connected with the driving mechanism and used forbearing the product, and the driving mechanism drives the material receiving mechanism to move in the vertical direction; and the product borne on the material receiving mechanism is placed on the adsorption positioning mechanism or the product on the adsorption positioning mechanism is separated from the adsorption positioning mechanism. The material receiving mechanism and the adsorption positioning mechanism are divided into two layers, the two layers do not influence each other, supporting rods and suction nozzles can be arranged at will, the material receiving mechanism can meet the space needs of material taking and placing of a mechanical arm, and the adsorption mechanism can meet the adsorption fixing and deformation correcting capacity of the product.

Description

technical field [0001] The present application relates to the technical field of laser cutting equipment, and more specifically, to an object stage of laser cutting equipment. Background technique [0002] On the basis of the current technology, during the production process of the liquid crystal panel, there is a terminal short-circuit ring cutting process, which requires cutting off the original ITO metal wire coating on the surface of the liquid crystal panel, and there should be no residue in the cutting line. During the processing of this process, the line width cut by the terminal short-circuit ring is very narrow, generally 50μm-250μm, which cannot be identified by naked eyes. The mature process plan is to use laser cutting and high-speed camera to detect the cutting effect at the same time. [0003] As we all know, laser processing has a certain depth of focus range, and the lens used with the camera also has a certain depth of field range. The so-called depth of f...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a stage for laser cutting equipment, which solves the problem that the existing processing equipment cannot meet the requirement of high flatness. The adsorption and positioning of the product by the adsorption positioning mechanism can ensure the flatness of the product and can correct the product. The warping deformation makes it meet the conditions of laser cutting and camera inspection

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