The invention discloses a PCB correction method which comprises the steps as follows: a, stacking a plurality of pieces of PCBs into PCB groups, and stacking the PCB groups into a pile, wherein a heat transmission component is placed between every two PCB groups; b, applying pressure to the top of the whole pile of stacked PCB groups and heating for roasting; and c, performing cold pressing on the pile of PCBs. The invention further discloses a PCB correction device which comprises a roaster, and a carrier used for stacking and placing PCBs to be corrected; and the PCB correction device is characterized in that the carrier can be arranged in the roaster in an in-out manner, and is provided with a pressurizing component capable of applying pressure to the whole pile of PCBs simultaneously, and heat transmission components. According to the invention, pressure is applied to the top of the whole pile after the plurality of groups of PCBs to be corrected are stacked into the whole pile, so that the pile of PCBs can be corrected simultaneously, and production efficiency is improved; and compared with the traditional method, the PCB correction method and device for correcting the PCBs, disclosed by the invention, have the advantage that, double-area products can be processed every time.