Deposition equipment and wafer deposition method based on multi-process chamber transmission
A deposition equipment and multi-process technology, which is applied in metal material coating process, vacuum evaporation coating, coating, etc., can solve the problem of difficult to effectively realize multi-process chamber deposition, low working efficiency of deposition equipment, large equipment footprint, etc. Problems, to achieve the effect of improving quickly and more steadily, increasing production capacity, and reducing floor space
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Embodiment 1
[0030] Such as Figure 1-2 As shown, the present invention provides a deposition device based on multi-process chamber transmission, and the deposition device includes: a feeding chamber 101, a cleaning chamber 102, a positioning chamber 110, deposition chambers 103, 105, 106, 107, 109, and a cooling chamber 104 , 108 , the feeding chamber 111 , the mechanical arm assembly 112 and the transfer chamber 100 . Among them, in one example, figure 1 Shown as a schematic top view of the deposition equipment of this example, the positional relationship between the various chambers and robotic arm components can be referred to figure 1 shown.
[0031] In the deposition equipment of the present invention, the feeding chamber 101 has a feeding chamber opening, the cleaning chamber 102 has a cleaning chamber opening, the positioning chamber 110 has a positioning chamber opening, and the deposition chambers 103, 105, 106, 107 , 109 have respective depositing chamber ports, the cooling c...
Embodiment 2
[0045] Such as image 3 As shown, the difference between the second embodiment and the first embodiment is that the robotic arm assembly set in the transfer chamber in this embodiment includes three robotic arm units, and compared with the first embodiment, there are four more deposition chamber and two cooling chambers. Such as image 3 As shown, the deposition equipment includes a loading chamber 201, a cleaning chamber 202, a positioning chamber 214, deposition chambers 203, 205, 207, 208, 209, 211, 213, cooling chambers 204, 206, 210, 212, and a feeding chamber 215 , the robot arm assembly 216 and the transfer chamber 200 . In one example, the shape of the transfer chamber 200 is a square, wherein the loading chamber 201 and the unloading chamber 215 are located on the outside of the predetermined side of the square, and the deposition chamber 208 is located on the outside of the opposite side; the cleaning chamber 202, the deposition chamber 203, the cooling chamber 20...
Embodiment 3
[0047] Such as Figure 4 Shown, the present invention also provides a kind of wafer deposition method, and described wafer deposition method comprises the steps:
[0048] First, provide the deposition equipment based on multi-process chamber transmission as described in any one of the above schemes, for example, it can be any scheme in Embodiment 1 and Embodiment 2;
[0049] Next, the wafer to be processed in the loading chamber is grabbed by the robot arm assembly, and the wafer to be processed is transferred to the cleaning chamber, the positioning chamber, the deposition chamber, and the cooling chamber And the feeding cavity is processed. For example, taking the deposition equipment in Embodiment 1 as an example, the transfer of wafers to be processed in each chamber is realized through the robot arm assembly 112, and the specific transfer sequence can be set according to the actual process to finally complete the deposition process.
[0050] In an example, the process c...
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