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Copper-based palladium coating composite bonding material

A bonding material and coating technology, which is applied in semiconductor/solid-state device components, electric solid-state devices, semiconductor devices, etc., can solve problems affecting product quality and service life, insufficient purity, high cost, etc. Oxidation, improved wire drawing ductility, low price and cost effects

Inactive Publication Date: 2020-11-17
深圳金斯达应用材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to material and process problems, the current gold-based silver-palladium composite bonding material is not pure enough, which affects the quality of the product and the service life.
[0003] The Chinese patent (authorized announcement number: CN111041267A) discloses a high-purity gold-based silver-palladium composite bonding material. The invention designs a gold-based silver-palladium composite bonding material made by formula and process, but gold itself is a very expensive metal. Although the material has excellent ductility, the cost is too high. How to reduce the operating cost and ensure the effect of composite bonding is a problem that needs to be improved in the existing technology

Method used

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  • Copper-based palladium coating composite bonding material

Examples

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Comparison scheme
Effect test

Embodiment 1

[0024] A copper-based palladium-coated composite bonding material, consisting of the following raw materials in parts by weight: 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 parts of chromium, and 0.3 parts of lithium , 2 parts of calcium, 1.6 parts of aluminum, and 0.15 parts of yttrium.

[0025] The preparation method of copper-based palladium coating composite bonding material described in this embodiment may further comprise the steps:

[0026] Step 1: taking each raw material in proportion;

[0027] Step 2: washing the above-mentioned materials with an aqueous sodium hydroxide solution with a mass concentration of 5% to 8%, and then washing with deionized water and drying to obtain a pretreated blank;

[0028] Step 3: Put the above-mentioned pre-treated billet into the vacuum melting and casting furnace with the copper ingot in the above-mentioned pre-treated billet. After the vacuum degree is ...

Embodiment 2

[0032] A copper-based palladium-coated composite bonding material, consisting of the following raw materials in parts by weight: 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 parts of chromium, and 0.3 parts of lithium , 2 parts of calcium, 1.6 parts of aluminum, and 0.15 parts of yttrium.

[0033] The preparation method of copper-based palladium coating composite bonding material described in this embodiment may further comprise the steps:

[0034] Step 1: taking each raw material in proportion;

[0035] Step 2: washing the above-mentioned materials with an aqueous sodium hydroxide solution with a mass concentration of 5% to 8%, and then washing with deionized water and drying to obtain a pretreated blank;

[0036] Step 3: Put the above-mentioned pre-treated billet into the vacuum melting and casting furnace with the copper ingot in the above-mentioned pre-treated billet. After the vacuum degree is ...

Embodiment 3

[0040] A copper-based palladium-coated composite bonding material, consisting of the following raw materials in parts by weight: 80 parts of copper, 35 parts of silver, 15 parts of palladium, 8 parts of zinc, 10 parts of carbon fiber reinforcement, 0.8 parts of chromium, and 3 parts of lithium , 1.5 parts of calcium, 1.2 parts of aluminum, and 0.09 parts of yttrium.

[0041] The preparation method of copper-based palladium coating composite bonding material described in this embodiment may further comprise the steps:

[0042] Step 1: taking each raw material in proportion;

[0043] Step 2: washing the above-mentioned materials with an aqueous sodium hydroxide solution with a mass concentration of 5% to 8%, and then washing with deionized water and drying to obtain a pretreated blank;

[0044] Step 3: Put the above-mentioned pretreated billet into the vacuum melting and casting furnace with the copper ingot in the above-mentioned pretreated billet, after the vacuum degree is h...

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Abstract

The invention relates to the technical field of composite bonding materials, in particular to a copper-based palladium coating composite bonding material. The copper-based palladium coating compositebonding material is composed of the following raw materials of, in parts by weight, 70-90 parts of copper, 30-40 parts of silver, 10-20 parts of palladium, 5-11 parts of zinc, 9-11 parts of carbon fiber reinforcement, 0.3-1.6 parts of chromium, 0.3-1.6 parts of lithium, 0.2-2 parts of calcium, 0.3-1.6 parts of aluminum and 0.05-0.15 part of yttrium. According to the copper-based palladium coatingcomposite bonding material, the overall material component is low, the component preparation is easy to obtain, and the problems that a traditional bonding wire is high in price, the surface is proneto oxidation, the bonding performance is poor, and drawing wire breakage is prone to occur can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of composite bonding materials, in particular to a copper-based palladium-coated composite bonding material. Background technique [0002] With the development of society and the continuous advancement of science and technology, more and more composite materials appear around people. Composite materials are a new material that people use advanced material preparation technology to optimize the combination of material components with different properties. , It is widely used in the fields of aerospace, automobile industry, chemical textile and machinery manufacturing, and promotes the development of modern high technology. Composite materials are usually divided into two categories: metal and non-metal. Among them, gold-based alloy is a kind of metal composite material, which usually uses gold as the matrix and adds other metal elements to it. Due to material and process problems, the current gold-based silv...

Claims

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Application Information

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IPC IPC(8): C22C47/08C22C49/02C22C49/14H01L23/49C22C101/10
CPCC22C47/08C22C49/02C22C49/14H01L24/45H01L2224/45139H01L2224/45147H01L2224/45164H01L2224/45565H01L2224/45664H01L2924/00014H01L2924/00011H01L2224/43848H01L2924/01049
Inventor 田鹏
Owner 深圳金斯达应用材料有限公司