Copper-based palladium coating composite bonding material
A bonding material and coating technology, which is applied in semiconductor/solid-state device components, electric solid-state devices, semiconductor devices, etc., can solve problems affecting product quality and service life, insufficient purity, high cost, etc. Oxidation, improved wire drawing ductility, low price and cost effects
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Embodiment 1
[0024] A copper-based palladium-coated composite bonding material, consisting of the following raw materials in parts by weight: 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 parts of chromium, and 0.3 parts of lithium , 2 parts of calcium, 1.6 parts of aluminum, and 0.15 parts of yttrium.
[0025] The preparation method of copper-based palladium coating composite bonding material described in this embodiment may further comprise the steps:
[0026] Step 1: taking each raw material in proportion;
[0027] Step 2: washing the above-mentioned materials with an aqueous sodium hydroxide solution with a mass concentration of 5% to 8%, and then washing with deionized water and drying to obtain a pretreated blank;
[0028] Step 3: Put the above-mentioned pre-treated billet into the vacuum melting and casting furnace with the copper ingot in the above-mentioned pre-treated billet. After the vacuum degree is ...
Embodiment 2
[0032] A copper-based palladium-coated composite bonding material, consisting of the following raw materials in parts by weight: 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 parts of chromium, and 0.3 parts of lithium , 2 parts of calcium, 1.6 parts of aluminum, and 0.15 parts of yttrium.
[0033] The preparation method of copper-based palladium coating composite bonding material described in this embodiment may further comprise the steps:
[0034] Step 1: taking each raw material in proportion;
[0035] Step 2: washing the above-mentioned materials with an aqueous sodium hydroxide solution with a mass concentration of 5% to 8%, and then washing with deionized water and drying to obtain a pretreated blank;
[0036] Step 3: Put the above-mentioned pre-treated billet into the vacuum melting and casting furnace with the copper ingot in the above-mentioned pre-treated billet. After the vacuum degree is ...
Embodiment 3
[0040] A copper-based palladium-coated composite bonding material, consisting of the following raw materials in parts by weight: 80 parts of copper, 35 parts of silver, 15 parts of palladium, 8 parts of zinc, 10 parts of carbon fiber reinforcement, 0.8 parts of chromium, and 3 parts of lithium , 1.5 parts of calcium, 1.2 parts of aluminum, and 0.09 parts of yttrium.
[0041] The preparation method of copper-based palladium coating composite bonding material described in this embodiment may further comprise the steps:
[0042] Step 1: taking each raw material in proportion;
[0043] Step 2: washing the above-mentioned materials with an aqueous sodium hydroxide solution with a mass concentration of 5% to 8%, and then washing with deionized water and drying to obtain a pretreated blank;
[0044] Step 3: Put the above-mentioned pretreated billet into the vacuum melting and casting furnace with the copper ingot in the above-mentioned pretreated billet, after the vacuum degree is h...
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