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Display substrate and manufacturing method thereof

A technology for display substrates and display areas, which is used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor/solid-state device testing/measurement, etc. Affect the display product yield and other issues, to achieve the effect of simplifying the production process and saving production costs

Pending Publication Date: 2020-11-17
BOE TECH GRP CO LTD +1
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Problems solved by technology

[0004] The purpose of the present invention is to provide a display substrate and a manufacturing method thereof, which are used to solve the problem that Ag particles generated during the process of forming the anode by wet etching will fall to the pixel area during the manufacturing stage of the OLED backplane BP, resulting in non-characteristic dark spots. Problems affecting the yield rate of display products

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  • Display substrate and manufacturing method thereof
  • Display substrate and manufacturing method thereof
  • Display substrate and manufacturing method thereof

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Embodiment Construction

[0041] In order to further illustrate the display substrate provided by the embodiments of the present invention and the manufacturing method thereof, a detailed description will be given below in conjunction with the accompanying drawings.

[0042] OLED display products generally include a display area and a test area located around the display area. The test area is provided with a test structure. The test structure includes a square contact pin (Pad). During the test, the test equipment is contacted with the contact pin to realize the test function.

[0043] Such as figure 1 and image 3 As shown, the contact pin is generally made of the same material as the source-drain metal layer in the display product, that is, it is formed into a "titanium-aluminum-titanium" laminated structure (such as image 3 The first sub-graph 231 in the graph uses Ti, the second sub-graph 232 uses Al, and the third sub-graph 233 uses Ti). There is a via structure under the contact pin, and the ...

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Abstract

The invention provides a display substrate and a manufacturing method thereof, relates to the technical field of display, and aims to solve the problems that in the manufacturing stage of a back plateBP of an OLED, Ag particles generated in the process of forming an anode through wet etching fall into a pixel region, non-characteristic dark spots are generated, and the yield of a display productis influenced. The display substrate comprises a display area and a test area located on the periphery of the display area. The test area is provided with a test structure, the test structure comprises a first conductive pattern, an insulating layer, a second conductive pattern and a third conductive pattern which are sequentially stacked in the direction away from a substrate of the display substrate, the first conductive pattern and the second conductive pattern are in contact through a via hole structure penetrating through the insulating layer, and the third conductive pattern covers the via hole structure. The third conductive pattern and an anode layer in the display substrate are arranged on the same layer and made of the same material; and the structure to be tested is connected with the first conductive pattern. The display substrate provided by the invention is used for displaying.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate and a manufacturing method thereof. Background technique [0002] As an important factor affecting the cost of OLED display products, the yield rate of organic light-emitting diode (English: Organic Light-Emitting Diode, OLED for short) display products has always been valued by people. There are many factors affecting the yield rate of OLED display products, among which dark spots are a common defect of OLED display products. The types of dark spots generally include characteristic dark spots and non-characteristic dark spots, and the occurrence rate of non-characteristic dark spots is relatively high. [0003] In the BP production stage of the OLED backplane, Ag particles will be generated during the process of wet etching to form the anode, and the Ag particles falling into the pixel area will cause a short circuit between the cathode and anode, resulting...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L23/544H01L21/77
CPCH01L22/32H10K59/179H10K71/70H10K59/1201
Inventor 郭晓亮蒋军董中飞林小兵王会丽刘卫东孟卫娟袁洪光
Owner BOE TECH GRP CO LTD