Printed circuit board and preparation method thereof

A printed circuit board and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuit, multilayer circuit manufacturing, etc., can solve the problems of signal loss, residual piles, etc., to reduce signal loss, save costs, The effect of improving the quality of signal transmission

Pending Publication Date: 2020-11-24
SHENNAN CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention provides a printed circuit board and its preparation method to solve the tec

Method used

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  • Printed circuit board and preparation method thereof
  • Printed circuit board and preparation method thereof
  • Printed circuit board and preparation method thereof

Examples

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Example

[0021] see figure 1 , the first embodiment of the method for preparing a printed circuit board of the present invention includes:

[0022] S101, forming a first via hole on a raw material board, wherein the raw material board includes a first insulating layer and upper and lower conductive layers disposed on both surfaces of the first insulating layer;

[0023] Among them, the raw material board is a double-layer printed circuit board, and both surfaces are provided with conductive layers.

[0024] S102, conducting conductive filling treatment on the first via hole to electrically connect the upper and lower conductive layers to form a first core board;

[0025] In this embodiment, the filled conductive material may be copper of the same material as the conductive layer. In other embodiments, the filled conductive material may also be other conductive metals, alloys, or carbon fibers, which is not limited herein.

[0026] S103 , laminating and pressing the first core board, ...

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Abstract

The invention discloses a printed circuit board and a preparation method thereof. The preparation method comprises the following steps: forming a first via hole in a raw material board; performing conductive filling processing on the first via hole to electrically connect the upper conductive layer and the lower conductive layer of the raw material plate to form a first core plate; and laminatingand pressing the first core plate, the second insulating layer and the first substrate to form the printed circuit board. According to the method, the problem that residual piles are left in back drilling in a traditional process can be solved, the signal loss is reduced, and the signal transmission quality of the printed circuit board is improved; expensive depth control drilling is avoided, andthe cost is saved.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a printed circuit board and a preparation method thereof. Background technique [0002] With the advent of the 5G era, the density of printed circuit boards, which are the core of electronic products, is getting higher and higher, and the number of layers is also increasing. It is unavoidable to use layer-changing vias for signals on complex multilayer printed circuit boards. With the expansion of signal bandwidth, the impedance continuity of conductor paths on printed circuit boards is becoming more and more important. [0003] The inventors of the present application have found through long-term research and development that currently such printed circuit boards are generally prepared by back-drilling crimping holes, but the existing back-drilling technology will leave stubs. For signal transmission, the smaller the stub, the smaller the signal loss. In the...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/42H05K1/11H05K1/02
CPCH05K1/0298H05K1/115H05K3/429H05K3/4623
Inventor 冷科马仁声李可佳刘海龙刘金峰武凤伍
Owner SHENNAN CIRCUITS
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