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X-ray detector based on field effect transistor structure and preparation method thereof

A field effect transistor and X-ray technology is applied in the field of X-ray detectors based on field effect transistor structures and their preparation, and can solve the problems of low sensitivity, bulkiness, complicated material growth and preparation process, etc.

Inactive Publication Date: 2020-12-08
深圳市中科瑞和企业管理服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the technical problem to be solved by the present invention is to provide a variety of new high-performance field-effect transistor X-ray detectors with heterojunctions composed of channel semiconductors and X-ray photoconductive materials, which are used to solve current problems. In the existing technology, the device is thick and bulky, the material growth and preparation process are complicated, the cost is high, the sensitivity is low, the limit detection dose rate is high, and the flexible and portable X-ray detector cannot be realized.

Method used

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  • X-ray detector based on field effect transistor structure and preparation method thereof
  • X-ray detector based on field effect transistor structure and preparation method thereof
  • X-ray detector based on field effect transistor structure and preparation method thereof

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Embodiment 1

[0081] Such as Figure 1a and Figure 1b It is a schematic diagram of the first device structure of the X-ray detector of the present invention, such as Figure 1a , including a substrate 1, located at the bottom of the X-ray detector; a gate electrode 2, the lower surface of the gate electrode 2 is made on the upper surface of the substrate 1; a gate dielectric layer 3, used for insulation, the The lower surface of the gate dielectric layer 3 is made on the upper surface of the gate electrode 2; the semiconductor channel layer 4 is used to transmit charges to generate channel current, and the lower surface of the semiconductor channel layer 4 is made on the said gate electrode 2. The upper surface of the gate dielectric layer 3; the X-ray layer 7 includes an X-ray absorbing layer 5, a source electrode 6-1 and a drain electrode 6-2, and the lower surface of the X-ray layer 7 is made on the semiconductor The upper surface of the channel layer 4, wherein the lower surface of the...

Embodiment 2

[0085] Such as Figure 2a and Figure 2b It is a schematic diagram of the second device structure of the X-ray detector of the present invention, such as Figure 2a , including a substrate 1, located at the bottom of the X-ray detector; a gate electrode 2, the lower surface of the gate electrode 2 is made on the upper surface of the substrate 1; a gate dielectric layer 3, used for insulation, the The lower surface of the gate dielectric layer 3 is made on the upper surface of the gate electrode 2; the semiconductor channel layer 4 is used to transmit charges to generate channel current, and the lower surface of the semiconductor channel layer 4 is made on the said gate electrode 2. The upper surface of the gate dielectric layer 3; the X-ray absorbing layer 5, the lower surface of the X-ray absorbing layer 5 is made on the upper surface of the semiconductor channel layer 4; the source electrode 6-1 and the drain electrode 6-2, the lower surface of the source electrode 6-1 and...

Embodiment 3

[0089] Such as Figure 3a and Figure 3b It is a schematic diagram of the third device structure of the X-ray detector of the present invention, such as Figure 3a , including a substrate 1, located at the bottom of the X-ray detector; a gate electrode 2, the lower surface of the gate electrode 2 is made on the upper surface of the substrate 1; a gate dielectric layer 3, used for insulation, the The lower surface of the gate dielectric layer 3 is made on the upper surface of the gate electrode 2; the semiconductor layer 8 includes a semiconductor channel layer 4, a source electrode 6-1 and a drain electrode 6-2, and the semiconductor layer 8 The lower surface of layer 8 is formed on the upper surface of the gate dielectric layer 3, wherein the lower surface of the semiconductor channel layer 4 is formed in the middle of the upper surface of the gate dielectric layer 3, covering all A part of the upper surface of the gate dielectric layer 3, the source electrode 6-1 and the d...

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Abstract

The invention discloses an X-ray detector based on a field effect transistor structure and a preparation method of the X-ray detector, and the X-ray detector comprises an X-ray absorption layer capable of absorbing X-rays, a semiconductor channel layer, a gate electrode, a gate dielectric layer, a source electrode, a drain electrode and a substrate. After the X-rays are irradiated to the X-ray absorption layer of the X-ray detector, electron-hole pairs are generated in the X-ray absorbing layer, electrons or holes generated by X-ray irradiation can be transferred from the X-ray absorption layer to the semiconductor channel layer, and the electrons or holes flow between the source electrode and the drain electrode to generate current. Compared with a traditional X-ray detector based on a diode, a photoelectric transistor combines the advantages of a transistor and a conventional photoconductive device, obtains efficient charge transfer by means of a heterojunction structure, generates ahuge gain amplification effect by means of efficient transmission of carriers in a semiconductor channel, and therefore, the high-performance X-ray detector with ultrahigh sensitivity and ultralow detection limit is obtained.

Description

technical field [0001] The invention belongs to the field of X-ray detectors, in particular to an X-ray detector based on a field-effect transistor structure and a preparation method thereof. Background technique [0002] X-ray detectors have important application value in the fields of medical diagnosis, scientific research, industrial non-destructive testing and national defense security. X-ray detectors are mainly based on two photoelectric conversion mechanisms: one is the direct X-ray detector, which directly converts the X-ray signal into an electrical signal through a photosensitive semiconductor material; the other is the indirect X-ray detector, which first passes through the scintillation The body converts X-rays into visible light, and then completes the conversion of optical signals into electrical signals through visible light detectors. At present, X-ray photodetectors based on these two photoelectric conversion mechanisms have been commercialized, but there a...

Claims

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Application Information

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IPC IPC(8): H01L31/119H01L31/18G01T1/24
CPCH01L31/119H01L31/18G01T1/241Y02P70/50
Inventor 高源鸿李建华
Owner 深圳市中科瑞和企业管理服务有限公司
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