Soaking plate structure without wick and preparation method thereof

A technology of soaking plate and liquid absorbing core, which is used in lighting and heating equipment, indirect heat exchangers, etc., can solve problems such as thickness limit and limit soaking plate, and achieve the effect of reducing thickness, reducing demand and shortening process flow
CN112077547AInactive Publication Date: 2020-12-15DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD
Publication Date
2020-12-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a soaking plate structure without a wick and a preparation method thereof. The soaking plate structure comprises a first cover plate and a second cover plate, wherein the firstcover plate and the second cover plate are mutually covered to form a cavity, and a plurality of supporting pieces are arranged in the cavity; and the cavity is filled with a working medium. According to the soaking plate structure without the wick and the preparation method thereof, a wick structure inside a soaking plate is omitted, the sintering process in the machining process is reduced, theeffect of remarkably saving energy consumption is achieved, the thickness of the soaking plate is further reduced, and the market development trend is met.
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Description

technical field

[0001] The invention relates to the technical field of heat dissipation products, in particular to a vapor chamber structure without a liquid-absorbing core and a preparation method thereof. Background technique

[0002] In 2019, the Ministry of Industry and Information Technology of China issued a 5G commercial license for the first time, and many equipment and communication manufacturers quickly followed up. As an application of 5G technology, large mobile phone manufacturers such as Huawei and Xiaomi quickly released 5G smartphones. The application of 5G technology means better user experience and higher power consumption. Power consumption will inevitably bring about the heat dissipation problem of related products in a small space. Ultra-thin heat pipes and vapor chambers, as the development and application hotspots of heat dissipation products, have been applied to more types of mobile phones. At present, the thickness of the vapor chamber has been re...

Claims

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