Soaking plate structure without wick and preparation method thereof

A technology of soaking plate and liquid absorbing core, which is used in lighting and heating equipment, indirect heat exchangers, etc., can solve problems such as thickness limit and limit soaking plate, and achieve the effect of reducing thickness, reducing demand and shortening process flow

Inactive Publication Date: 2020-12-15
DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are two structures inside the vapor chamber currently on the market: a liquid-absorbing core and a steam cavity, and the two structures are arranged up and down to form the internal working fluid backflow. This arrangement has a thickness limit, which limits the vapor chamber. Thinner Design Capability

Method used

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  • Soaking plate structure without wick and preparation method thereof
  • Soaking plate structure without wick and preparation method thereof
  • Soaking plate structure without wick and preparation method thereof

Examples

Experimental program
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Embodiment 1

[0019] figure 1 It schematically shows the processing flow of the vapor chamber structure without a liquid-absorbing core according to an embodiment of the present invention, and the specific steps are as follows:

[0020] S1. Select two plates, which are the first cover plate 10 and the second cover plate respectively.

[0021] S2. After cutting the first cover plate 10 and the second cover plate into a symmetrical rectangle of suitable size, use a punching machine to punch out a groove in the middle of the inner surface of the first cover plate 10 and the second cover plate respectively, They are respectively the first recess 11 and the second recess. The first recess 11 and the second recess are arranged symmetrically, and the inner surface of the first cover 10 and the inner surface of the second cover are attached to each other. The first recess 11 and the second recess can jointly define a cavity. Stamping can ensure that the shapes of the first cover plate 10 and the ...

Embodiment 2

[0026] The difference between this embodiment and embodiment 1 is:

[0027] In S2 and S3, the first recess 11 and the second recess on the first cover 10 and the second cover, as well as the structure of the supporting member 20 located in the first recess 11 and the second recess are formed by etching at one time. The etching process is mature, and the shape and internal structure of the first cover plate 10 and the second cover plate can be processed in one step, which simplifies the process flow.

[0028] Both the first recess 11 and the support 20 in the second recess have one end connected to the edge of the cavity, and the other end is not connected to the edge of the cavity, and the support 20 alternates the connection position with the cavity at intervals, Arranged crosswise in the shape of "back", the internal structure of the first cover plate 10 is as follows: image 3 The internal structure of the second cover shown is symmetrical thereto.

[0029] In S4 and S5, ...

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Abstract

The invention discloses a soaking plate structure without a wick and a preparation method thereof. The soaking plate structure comprises a first cover plate and a second cover plate, wherein the firstcover plate and the second cover plate are mutually covered to form a cavity, and a plurality of supporting pieces are arranged in the cavity; and the cavity is filled with a working medium. According to the soaking plate structure without the wick and the preparation method thereof, a wick structure inside a soaking plate is omitted, the sintering process in the machining process is reduced, theeffect of remarkably saving energy consumption is achieved, the thickness of the soaking plate is further reduced, and the market development trend is met.

Description

technical field [0001] The invention relates to the technical field of heat dissipation products, in particular to a vapor chamber structure without a liquid-absorbing core and a preparation method thereof. Background technique [0002] In 2019, the Ministry of Industry and Information Technology of China issued a 5G commercial license for the first time, and many equipment and communication manufacturers quickly followed up. As an application of 5G technology, large mobile phone manufacturers such as Huawei and Xiaomi quickly released 5G smartphones. The application of 5G technology means better user experience and higher power consumption. Power consumption will inevitably bring about the heat dissipation problem of related products in a small space. Ultra-thin heat pipes and vapor chambers, as the development and application hotspots of heat dissipation products, have been applied to more types of mobile phones. At present, the thickness of the vapor chamber has been re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/26F28D15/02
CPCB23P15/26F28D15/02
Inventor 于全耀梁平平
Owner DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD
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