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Low-dielectric-loss heat conduction material and preparation method thereof

A heat-conducting material and low-dielectric technology, applied in the field of low-dielectric loss heat-conducting materials, can solve problems such as low degree of automation, affecting product performance, and low production efficiency, achieve scientific and standardized manufacturing methods, improve mechanical properties, and increase production efficiency Effect

Inactive Publication Date: 2020-12-29
中广核高新核材集团(东莞)祈富新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] LCP thermally conductive materials are often used in the manufacture of sporting goods, brake pads, films, soft printed circuits, microwave oven containers, satellite-based electronic components, etc. due to their excellent heat resistance and easy-to-form processing properties. It is not scientific and reasonable enough, which leads to the low mechanical properties of the thermal conductive materials produced. The existing production process of thermal conductive materials is not standardized enough, and the degree of automation is low, which leads to low production efficiency and affects the performance of the product.

Method used

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  • Low-dielectric-loss heat conduction material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A heat-conducting material with low dielectric loss, the formula includes: PA plastic, compatibilizer, heat-conducting powder and modifier, and the mass percentages of each component are: 75% of PA plastic, 10% of compatibilizer , 14.5% thermal conductive powder and 0.5% modifier.

[0032] A method for producing a heat-conducting material with low dielectric loss, comprising the following steps: step 1, material selection and ingredients; step 2, mixing and stirring; step 3, melting and extrusion; step 4, granulation and packaging; step 5, quality inspection and storage;

[0033] Wherein the above-mentioned step 1, according to the mass percentage content of each component is respectively: 75% PA plastics, 10% compatibilizer, 14.5% heat conduction powder and 0.5% modifying agent are selected, and according to weight The sum of the percentages is 1 for weighing;

[0034] Wherein in above-mentioned step two, mixing and stirring comprises the following steps:

[0035] 1)...

Embodiment 2

[0048] A heat-conducting material with low dielectric loss, the formula includes: PA plastic, compatibilizer, heat-conducting powder and modifier, and the mass percentages of each component are: 80% PA plastic, 5% compatibilizer , 14.5% thermal conductive powder and 0.5% modifier.

[0049] A method for producing a heat-conducting material with low dielectric loss, comprising the following steps: step 1, material selection and ingredients; step 2, mixing and stirring; step 3, melting and extrusion; step 4, granulation and packaging; step 5, quality inspection and storage;

[0050] Wherein the above-mentioned step 1, according to the mass percentage content of each component is respectively: 80% PA plastics, 5% compatibilizer, 14.5% heat conduction powder and 0.5% modifying agent are selected, and according to weight The sum of the percentages is 1 for weighing;

[0051] Wherein in above-mentioned step two, mixing and stirring comprises the following steps:

[0052] 1) Put the...

Embodiment 3

[0065] A heat-conducting material with low dielectric loss, the formula includes: PA plastic, compatibilizer, heat-conducting powder and modifier, and the mass percentages of each component are: 70% PA plastic, 15% compatibilizer , 14.5% thermal conductive powder and 0.5% modifier.

[0066] A method for producing a heat-conducting material with low dielectric loss, comprising the following steps: step 1, material selection and ingredients; step 2, mixing and stirring; step 3, melting and extrusion; step 4, granulation and packaging; step 5, quality inspection and storage;

[0067] Wherein the above-mentioned step one, according to the mass percentage content of each component is respectively: 70% PA plastics, 15% compatibilizer, 14.5% heat conduction powder and 0.5% modifying agent are selected, and according to weight The sum of the percentages is 1 for weighing;

[0068] Wherein in above-mentioned step two, mixing and stirring comprises the following steps:

[0069] 1) Put...

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Abstract

The invention discloses a low-dielectric-loss heat conduction material and a preparation method thereof. The formula of the low-dielectric-loss heat conduction material comprises 680% of PA plastic, 9.10% of a compatilizer, 9.15% of heat conduction powder and 0.0.5% of a modifier. The preparation method comprises the following steps: 1, selecting and proportioning materials; 2, mixing and stirring; 3, carrying out melt extrusion; 4, granulating and packaging; and 5, carrying out quality inspection and warehousing. Compared with an existing heat conduction material formula, the formula and theproportion of the raw materials are innovated, the mechanical property of the material can be greatly improved, and the low dielectric property that the dielectric loss of the heat conduction materialis smaller than 0.004 is achieved; the heat resistance of the heat conduction material is further improved; the fluidity of the heat conduction material is further improved, so that the heat conduction material can be used as a material of a smaller and narrow-needle-spacing connector; and the preparation method provided by the invention is more scientific and normative, the production efficiencycan be greatly improved, and the reduction of the mechanical property and the physical property of a finished product due to the defects of the preparation method can be avoided.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat-conducting material with low dielectric loss and a preparation method thereof. Background technique [0002] LCP thermally conductive materials are often used in the manufacture of sporting goods, brake pads, films, soft printed circuits, microwave oven containers, satellite-based electronic components, etc. due to their excellent heat resistance and easy-to-form processing properties. It is not scientific and reasonable enough, which leads to the low mechanical properties of the thermally conductive materials produced. The existing production process of thermally conductive materials is not standardized enough, and the degree of automation is low, which leads to low production efficiency and affects the performance of the product. Contents of the invention [0003] The object of the present invention is to provide a low dielectric loss thermally conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08L51/00C08K9/00C08K3/22C08K3/38C09K5/14
CPCC08L77/00C09K5/14C08K2003/2227C08K2003/385C08L2201/08
Inventor 陈建林
Owner 中广核高新核材集团(东莞)祈富新材料有限公司