Probe for measuring thermal conductivity and preparation method thereof

A technology of thermal conductivity and nickel strip, which is applied in the field of thermal conductivity test probes, can solve problems such as poor repeatability of measurement results, influence on experimental progress, shorten service life, etc., and achieve the effect of avoiding line sequence errors, firm service life and prolonging service life

Active Publication Date: 2021-12-21
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The probe currently used is mainly to connect the four lead wires at the end of the probe with the four joints of a cable through connectors. Before each use, each lead wire of the probe needs to be connected to one joint of the cable. Probes of different specifications need to be used, and a wiring operation is required every time the probe is replaced. shorten its life
In addition, when the probe is connected to the cable through the connector, the resistance of the probe will be affected by the connector. Since each connection is different from the previous one, the repeatability of the measurement results is poor.

Method used

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  • Probe for measuring thermal conductivity and preparation method thereof
  • Probe for measuring thermal conductivity and preparation method thereof
  • Probe for measuring thermal conductivity and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as figure 1As shown, a probe for measuring thermal conductivity includes: a probe body, a cable 7, an insulating layer 6 and a plug 8, the probe body is a sandwich structure, and the sandwich structure is composed of a metal layer and 2 insulating layers 5, 2 pieces A metal layer is sandwiched between the insulating layers 5, and the insulating layer 5 plays the role of insulation and increasing mechanical strength. The head of the metal layer is a planar double helix structure 1, and a metal nickel strip forms a planar double helix structure 1 from the inside to the periphery, and the two ends of the metal nickel strip extend from the tail of the plane double helix structure 1 towards the tail of the metal layer and Each end of the metal nickel strip forms 2 nickel strips 2, and 4 nickel strips 2 form the tail of the metal layer. A lead wire 4 is welded on each nickel strip 2, and a welding point 3 is formed at the welding place. One end of the cable 7 is connecte...

Embodiment 2

[0048] On the basis of Embodiment 1, the edge of the insulating layer 5 protrudes from the side edge of the metal layer by a distance of 1-5 mm, for example, 2 mm. The material of the insulating layer 5 can be polyimide. When the material of the insulating layer 5 is polyimide, according to the heat resistance of the material selected for the insulating layer 5 , the normal working temperature range of the probe is -50-230°C. When the material of the insulating layer 5 is mica, the normal working temperature range of the probe is -50~1000℃

[0049] The thickness of the insulating layer 5 is 7-100 μm, for example, 50 μm.

[0050] The outer diameter of the double helix structure is related to the width of the metal nickel ribbon and the number of double helix turns, specifically, the outer diameter of the double helix structure=the width of the metal nickel ribbon*the number of turns*4. The outer diameter of the double helix structure is 4-100 mm, for example, 4.8 mm.

[0051...

Embodiment 3

[0059] On the basis of Embodiment 2, the connection method between the lead wire 4 and the nickel strip 2 is: one end of the lead wire 4 penetrates through the insulating layer 5 and is welded to the nickel strip 2 .

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Abstract

The invention discloses a probe for measuring thermal conductivity and a preparation method thereof. The probe comprises: a probe main body, a cable, an insulating glue layer and a plug. The probe main body is composed of a metal layer and two insulating layers. A metal layer is sandwiched, the head of the metal layer is a planar double helix structure, and a metal nickel strip forms a planar double helix structure from the inside to the periphery, and the two ends of the metal nickel strip are from the tail of the plane double helix structure to the tail of the metal layer Extend and each end of the metal nickel thin strip forms 2 nickel strips, each nickel strip is connected with a lead wire, one end of the cable is electrically connected with 4 lead wires, and the other end is connected with a plug. The cable includes 4 connecting wires, each A connecting wire is connected to a lead wire. The plug can be directly connected to the socket on the chassis of the thermal conductivity tester, and there is no need for connectors between the cable and the probe body, which avoids errors in the probe line sequence, is easy to use, and has accurate and repeatable measurement results.

Description

technical field [0001] The invention belongs to the technical field of thermal conductivity test probes, and in particular relates to a probe for measuring thermal conductivity and a preparation method thereof. Background technique [0002] Thermal conductivity, as a thermophysical constant reflecting the thermal conductivity and thermal insulation capabilities of materials, has a wide range of applications and research values ​​in many fields such as industrial manufacturing, building environmental protection and energy conservation, aerospace research, etc. Therefore, accurate measurement of thermal conductivity is very important. Among the numerous measurement methods, the Transient Plane Source (TPS) method has attracted widespread attention and been widely used because of its high measurement efficiency and good measurement accuracy. The transient plane heat source method is also called the HotDisk method. This method has no special requirements on the shape of the samp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 李艳宁屈雁鑫
Owner TIANJIN UNIV
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