Film-wrapped chip adhesive film and semiconductor package including the same

Abstract

The invention relates to a film-wrapped chip adhesive film and a semiconductor package including the same. The film-wrapped chip adhesive film of the present invention may include a laminated structure including: an adhesive layer; and a support layer laminated on one side of the adhesive layer.

Description

technical field [0001] The present invention relates to a controller chip embedding type adhesive film suitable for a semiconductor package adopting a film on die (FOD, Film on die) method, and a semiconductor package using the same. Background technique [0002] In the existing semiconductor package manufacturing process, a multi-step process method including a wire bonding process and a plastic sealing process is usually adopted, that is, when the semiconductor chip is attached to the lead frame or circuit board components, the pad used to fix the chip is first After injecting and applying a liquid adhesive to the part of the chip to adhere the semiconductor chip there, the liquid adhesive layer is cured at a high temperature for a specified period of time, and in the wire bonding process, the bonding pad of the semiconductor chip and The method of exchanging electrical signals between the bonding areas of the substrate is soldered with leads, and the semiconductor chip an...

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Problems solved by technology

[0007] However, the semiconductor package using the film-wrapped die-attach film needs to separately manage the semiconductor chip (wafer) laminated on the film-wrapped die-attach film and the semiconductor chip laminated on the die-attach film

Therefore, the semiconductor package using the film-wrapped die attach film has a problem that the total yield is lower than that of the general semiconductor package

[0008] Also, in the process of using the film-wrapped die-attach film for the semiconductor package, when performing the dicing process of dicing the film-wrapped die-attach film to a specified size, there may be an increase in pick-up failure due to excessive welding of the adhesive layer. rate problem

[0009] Also, when transferring the film-wrapped die-attach film for use in semiconductor packages, there is a problem of jamming due to the thickness of the film-wrapped die-attach film

[0010] In addition, when performing a die-attach process in which a film-wrapped die adhesive film is attached to a substrate and a semiconductor chip is stacked on the film-wrapped die-adhesive film, the controller chip may not be properly embedded in the film-wrapped die-attached film. The problem of unqualified stacking of semiconductor chips caused by the inside of the film

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