Industrial robot with automatic feeding and discharging functions and method

Abstract

The invention discloses an industrial robot with automatic feeding and discharging functions and a method, the industrial robot comprises a rack, a stock bin is arranged in the rack, a feeding assembly and a discharging assembly are symmetrically arranged in the stock bin, first lead screw modules are symmetrically arranged at the top end of the rack, a positioning disc is arranged at the tops ofthe two first lead screw modules, clamping mechanisms are symmetrically arranged on the positioning disc, a tool disc is clamped between the two clamping mechanisms, separation mechanisms are symmetrically arranged on the two sides of each clamping mechanism, a supporting arm is arranged on one side of the rack, a second lead screw module is arranged on the supporting arm, a manipulator mechanismis arranged on the second lead screw module, and optical fiber sensors are arranged at the positions, located on one sides of the separation mechanisms, of the bottom end of the positioning disc. Theindustrial robot with the automatic feeding and discharging functions and the method have the beneficial effects that automatic feeding and discharging of lead frames at the middle end or the tail endof a production line can be achieved, the lead frames are loaded through the tool disc and is convenient to store, and the situation that in the prior art, when manual feeding and discharging are adopted, the surfaces of lead frames are prone to be scratched, and consequently, the follow-up packaging effect is affected can be avoided.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging equipment, in particular to an industrial robot with automatic loading and unloading of materials and a method thereof. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. When the lead frame and chip are packaged, in the actual manufacturing process of electronic products, the surface of the material is required not to be bumped or scratched. In the prior art, manual loading and unloading is generally use...

AI Technical Summary

Problems solved by technology

When the lead frame and chip are packaged, in the actual manufacturing process of electronic products, the surface of the material must not be bumped or scratched. In the prior art, manual loading and unloading is generally used to place the material in the material tray, and then place the Material trays are stacked layer by layer, which will inevitably cause bumps or scratches between materials when loading and unloading materials, which will directly affect the connection between the integrated circuit on the lead frame and the outer leads, which may cause overlapping, short circuit or non-use of the lines. In addition, the existing The stacked material trays in the technology may lift the lower material tray when the upper material tray is clamped, increasing the risk of material slipping

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