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Manufacturing method of circuit substrate

A manufacturing method and circuit substrate technology, applied in printed circuit manufacturing, metal core circuit manufacturing, printed circuit, etc., can solve problems such as waste of copper metal, pollution, etc., and achieve the effect of increasing speed

Inactive Publication Date: 2021-02-02
POLYTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the process of thick copper etching, not only a large amount of copper metal will be wasted, but also the environment will be polluted due to the strong acid solution used.

Method used

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  • Manufacturing method of circuit substrate
  • Manufacturing method of circuit substrate
  • Manufacturing method of circuit substrate

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Embodiment Construction

[0029] In order to make the above and other technical contents, features and advantages of the present invention more comprehensible, relevant embodiments are specifically listed below, together with the accompanying drawings, and are described in detail as follows.

[0030] Figure 1 to Figure 5 A schematic diagram showing the structure of a circuit substrate in various manufacturing stages according to an embodiment of the present invention. refer to figure 1 Firstly, a laminated board 10 is provided, and the laminated board 10 includes a metal substrate 13 , an insulating layer 11 and a circuit layer 12 . The insulating layer 11 is located on the upper surface of the metal substrate 13 , and the circuit layer 12 is located on the upper surface of the insulating layer 11 , forming a stacked structure in sequence. The thickness of the metal substrate 13 is about 0.3-5mm, which can be a copper metal layer or an aluminum metal layer, as a heat dissipation substrate. The thic...

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Abstract

A manufacturing method of a circuit substrate comprises the steps of providing a laminated substrate comprising an insulating layer and a circuit layer disposed on the insulating layer; forming a photoresist layer on the circuit layer; mechanically cutting the photoresist layer and a part of the circuit layer to form gaps; etching the circuit layer in the gaps until a surface of the insulating layer is exposed to form a circuit layout; and removing the photoresist layer to form the circuit substrate.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit substrate, in particular to a method for manufacturing a circuit substrate with a thick circuit layer. Background technique [0002] With the development of science and technology, the number of components installed on the circuit board is increasing, or the application requirements of large currents such as charging piles for electric vehicles, DC-DC conversion output, etc., together with the current conduction of the circuit board circuit The traffic capacity and carrying capacity are also very demanding. Because high current usually also produces high heat, which leads to the requirement that the circuit board needs good heat dissipation. Therefore, there is a need for a thermally conductive circuit substrate with increased copper layer thickness to carry a large current of 40A to 200A. [0003] High current thermally conductive circuit substrates can traditionally be etched with thick ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/04H05K3/06
CPCH05K3/02H05K3/04H05K3/06H05K3/44H05K3/064H05K1/056H05K2203/0228H05K2203/0557H05K3/067C23F1/18H05K2203/0207
Inventor 江逊旌杨翔云
Owner POLYTRONICS TECH