Dental adhesive pretreatment system based on copper and zinc ions and application
A pretreatment, zinc ion technology, applied in the dental bonding pretreatment aid of zinc ion, based on copper, the field of tooth surface pretreatment process, can solve the problem of affecting the bonding effect, the degree of tooth surface wetness is not standard, very difficult. technical sensitivity and other issues, to achieve the effect of eliminating hydration ability, preventing secondary caries, and reducing technical sensitivity
Active Publication Date: 2021-02-09
ZHEJIANG UNIV
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Problems solved by technology
[0008] In addition, in the wet bonding technology, there is no standard for the degree of wetness of the tooth surface to be coated with adhesive, too wet or too dry tooth surface will affect the bonding effect, which has great technical sensitivity
Method used
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Effect test
Embodiment 1
[0048] The surface of dentin was rinsed with water vapor after phosphoric acid etching, and the surface was kept wet or the surface was blown dry.
Embodiment 2
[0050] Dentin surface was rinsed with water vapor after phosphoric acid etching treatment, and 20 μl of solution (A) with a mass fraction of 0.25% copper sulfate aqueous solution was applied to the surface for 20 seconds, rinsed with water vapor, and the surface was kept wet or dried.
Embodiment 3
[0052] Dentin surface was rinsed with water vapor after phosphoric acid etching treatment, and 20 μl of solution (A) with a mass fraction of 0.25% copper sulfate aqueous solution was applied to the surface for 20 seconds, and then 20 μl of solution (B): 0.078% with a mass fraction of sodium sulfide aqueous solution for 20 seconds, rinsed with water vapor, Leave surface wet or surface blow dry.
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The invention provides a dental adhesive pretreatment system based on copper and zinc ions and application. A solution (A), a solution (B) and a solution (C) form a unitary system, a binary system ora ternary system. Copper / zinc ions are bonded with side chains such as carboxyl, hydroxyl, carbonyl and sulfydryl in the demineralized dentin organic matrix to form copper / zinc-containing insoluble nanoparticles, so that the dentin organic matrix is endowed with antibacterial performance, the strength and the specific surface area of the demineralized dentin matrix are remarkably increased, three-dimensional network of the demineralized dentin organic matrix can resist water loss and shrinkage, higher compatibility is obtained between an adhesive interface and an adhesive monomer, permeation and uniform distribution of an adhesive are promoted, and the adhesive strength and the adhesive durability are improved. According to the demineralized dentin matrix surface treated by the pretreatment agent prepared by the pretreatment system, no matter whether the tooth surface is wet or dry during adhesive coating, high adhesive strength and durability can be obtained, and the technical sensitivity of clinical operation is greatly reduced.
Description
technical field [0001] The invention belongs to the field of dental bonding restoration materials, and relates to a dental bonding pretreatment system based on copper and zinc ions and its application, mainly a dental bonding pretreatment auxiliary agent based on copper and zinc ions, which is used to prevent Tooth surface pretreatment process that can cause caries, improve bonding effect, and reduce the sensitivity of bonding operation technology. Background technique [0002] In dental care, the restoration of tooth defects takes up most of the doctor's time. Whether it is direct restoration or indirect restoration, it is inseparable from the use of bonding materials. [0003] A strong and long-lasting bond between the tooth tissue and the bonding material is the key to a successful restoration. As one of the bonding interfaces with complex structures, dentin's surface treatment determines the bonding strength and bonding durability, which directly affects the clinical re...
Claims
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Login to view more IPC IPC(8): A61K6/35
CPCA61K6/35
Inventor 李晓东罗巧洁许佳佳
Owner ZHEJIANG UNIV
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