Antioxidant mixed solution and FPC etching method for reducing under-film oxidation

Abstract

The invention discloses an antioxidant mixed solution and an FPC etching method for reducing under-film oxidation, the antioxidant mixed solution uses water as a solvent, and comprises 4.5%-9.5% by volume of methanol and 0.1%-1% by volume of ferulic acid; and according to the FPC etching method, the antioxidant mixed solution is used, the FPC is sequentially subjected to one-time commercial waterwashing, three-time sulfuric acid and hydrogen peroxide mixed micro-etching, two-time commercial water washing, one-time antioxidant mixed solution treatment, two-time commercial water washing and one-time pure water washing, and finally drying is carried out. According to the invention, methanol and ferulic acid are mixed to prepare the antioxidant mixed solution, molecular structures of the twosolutions contain groups for increasing electronegativity of central atoms such as conjugated large pi bonds, groups for increasing water solubility such as carboxyl and hydroxyl for providing hydrogen protons, and the two solutions have strong active groups and can inhibit and eliminate free radicals so as to prevent oxidation; the method can be used for immediately carrying out antioxidant process treatment after FPC surface micro-etching treatment, the antioxidant treatment effect is guaranteed, and on the premise that the production cost is controlled, poor oxidation under a cover film isgreatly reduced finally.

Description

technical field [0001] The invention relates to the technical field of FPC production, in particular to an anti-oxidation mixed solution and an FPC etching method for reducing under-film oxidation. Background technique [0002] With the development of the FPC industry to the present, various production processes are basically mature, and the profit margins of enterprises are basically transparent. In the case of increasingly severe competition in the industry, enterprises must optimize their internal costs if they want to gain a greater competitive advantage in the market. [0003] Oxidation under the film is an inevitable bad item in the FPC processing process. The traditional process controls the temperature and humidity of the clean room to reduce the oxidation of the copper surface after etching. For poor oxidation found after etching, the industry generally adopts two solutions: [0004] 1. If the defect rate is not high, the yield rate operation will be sacrificed, re...

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Problems solved by technology

[0004] 1. If the defect rate is not high, the yield rate operation will be sacrificed, resulting in material waste, which is equivalent to increasing the production cost;

[0005] 2. When the rate of poor oxidation is high, add surface treatment process to remove oxidation before film application. This method not only increases production cost, but also cannot remove 100% line oxidation

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