Resistive random access memory and manufacturing method thereof
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI HUALI MICROELECTRONICS CORP
- Publication Date
- 2021-02-26
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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a resistive variable memory and a manufacturing method thereof. Background technique
[0002] With the development of semiconductor technology, the market demand for non-volatile memory is increasingly shifting towards large capacity, low power consumption, high density and low cost. Resistive Random Access Memory (RRAM) is a research hotspot of next-generation memory, has strong application potential, and is considered to be the memory with the most commercial value.
[0003] In the existing resistive variable memory, it generally includes: a semiconductor substrate, a bottom electrode, a resistive layer and a top electrode, the bottom electrode covers the semiconductor substrate, the resistive layer covers the bottom electrode, the A top electrode covers the resistive switch layer. Wherein, the resistive switch layer has oxygen atoms. In the resi...