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Conductive particle, method for producing same, conductive material, contact structure, electrical component, and electronic component

A technology of conductive particles and manufacturing methods, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, electrical components, printed circuit components, etc., can solve the problem of reducing the limited contact resistance and not taking into account the increase in the resistance of the conductive layer of conductive particles, etc. problem, achieve the effect of reducing initial contact resistance, improving contact reliability, and low initial resistance

Active Publication Date: 2021-02-02
DUK SAN NEOLUX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the above method only focuses on making the conductive particles penetrate the oxide coating, and is still limited in substantially reducing the contact resistance.
That is, it does not take into account the resistance increase of the conductive particle conductive layer due to the deformation of the conductive layer when the upper limit electrode is joined.

Method used

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  • Conductive particle, method for producing same, conductive material, contact structure, electrical component, and electronic component
  • Conductive particle, method for producing same, conductive material, contact structure, electrical component, and electronic component
  • Conductive particle, method for producing same, conductive material, contact structure, electrical component, and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] Embodiment 1: Manufacture of Conductive Particle 1

[0120] 1) Manufacture of insulating core resin particles (S1a)

[0121] Put 800g of monomer trimethylolpropane ethoxylate triacrylate (TMPETA, Trimethylolpropane ethoxylate triacrylate) and 50g of 1,6-hexanediol ethoxylate diacrylate (HDEDA, 1,6- Hexanediol ethoxylate diacrylate) and 800g of divinylbenzene (DVB, Divinylbenzene) and 5g of benzoyl peroxide (BPO) were added and then treated in a 40kHz ultrasonic cleaner (bath) for 10 minutes to prepare the first solution.

[0122] Dissolve 500 g of dispersion stabilizer polyvinylpyrrolidone (PVP, Polyvinylpyrrolidone)-30K and surfactant dioctylsulfosuccinate sodium salt (Solusol, Dioctylsulfosuccinate sodium salt) to 4,000 g in a 5 L polypropylene (PP) beaker deionized water to prepare the second solution.

[0123] After putting the above-mentioned first solution and second solution into a 50L reactor and adding 41,000g of deionized water, it was treated with an ult...

Embodiment 2

[0142] Embodiment 2: Manufacture of conductive particle 2

[0143] The processes up to the catalyst treatment process among the processes of the above-mentioned Example 1 were performed in the same manner, and then the gold plating process was performed as described below.

[0144] 3-i) Dispersion of the insulating core (S2a)

[0145] After putting 3,500g of deionized water into a 5L reactor, dissolve 265g of nickel sulfate as a Ni salt, 5g of sodium acetate as a complexing agent, 2g of lactic acid, and 0.001g of Pb-acetate as a stabilizer And 0.001g of sodium thiosulfate, 1g of polyethylene glycol (PEG)-1200 and 0.02g of triton (Triton) X100 as a surfactant to produce a gold plating solution (a-2). The above catalyst-treated insulating core resin fine particles were thrown into the produced (a-2) solution, and then dispersion treatment was performed for 10 minutes with an ultrasonic homogenizer (Homogenizer). After the dispersion treatment, the pH of the solution was adju...

Embodiment 3

[0151] Embodiment 3: Anti-rust treatment of conductive particles 1

[0152] 20 g of SG-1 (MSC; product name) was added to 500 g of deionized water, and the temperature of the solution was maintained at 60°C. Ultrasonic treatment was performed for 5 minutes after 10 g of the conductive particles produced in Example 1 were dropped into the solution maintained at 60°C. Antirust-treated conductive particles are obtained by performing washing, filtering, and drying processes on the ultrasonically processed conductive particles.

[0153] Whether the antirust treatment was successfully completed was confirmed by confirming whether the weight ratio of the conductive particles floating on the deionized water reached 98% or more when the dried and antirust treated conductive particles were dropped into the deionized water.

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Abstract

Provided are: conductive particles which are suitable for maintaining electrical contact due to little increase in initial electrical contact resistance and resistance after 85 DEG C / 85% reliability evaluation; a method for producing the conductive particles; a conductive material; a contact structure; and electrical and electronic components. The conductive particles are used in anisotropic conductive materials such as anisotropic conductive films and anisotropic conductive pastes, and each conductive particle has an insulator core and a conductive layer on the surface of the core. The present invention is characterized in that: the conductive layer is provided with protrusions, and the protrusions and the conductive layer are an alloy comprising a first element constituting the base andat least one or more second elements or a plurality of second elements selected from the group consisting of P, B, Cu, Au, Ag, W, Mo, Pd, Co, and Pt; the second element or at least one of the plurality of second elements has a first concentration on the inner side of the conductive layer and a second concentration on the outer side of the gold plating side, and the second concentration is greaterthan the first concentration.

Description

technical field [0001] The present invention relates to a conductive particle, a conductive material, a contact structure, an electrical and electronic component, and in particular to an insulator core with protrusions formed on the surface of the insulator and the concentration of alloy elements in the composition toward the outer profile side and then toward the protrusion. The conductive layer gradually increases on one side, so that when used as a conductor of a conductive material, it can easily penetrate the oxide plating layer of the electrode and minimize the deformation of the conductive layer of the conductive particle. Conductive particles with excellent high-temperature / high-humidity reliability, Conductive materials, contact structures, electrical and electronic components. Background technique [0002] Conductive particles are suitable for anisotropic conductive materials used in a dispersed form by mixing with hardeners, adhesives, and resin binders, such as a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02H01B1/22H01B5/14H01B13/00H05K1/09
CPCH01B5/14H01B1/02H01B1/22H01B13/00H05K1/09C08J3/128
Inventor 金敬钦郑舜浩裵仓完金泰根金钟兑朴俊奕林永真李枝原崔阭秀秋龙喆
Owner DUK SAN NEOLUX
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