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Full-color SMD LED with enhanced waterproof performance

A LED chip and performance technology, applied in the direction of instruments, electrical components, electric solid devices, etc., can solve the problems of double-electrode chip electrode metal migration failure, colloid and substrate delamination, silver colloid delamination failure, etc., to achieve air tightness Good, the degree of delamination is reduced, and the effect of reducing production costs

Pending Publication Date: 2021-03-05
ZHEJIANG INTELED OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moisture directly infiltrates into the functional area from the edge of the lamp bead and the through hole. In the lighted state, it will lead to the failure of the metal migration of the double-electrode chip electrode, the failure of leakage, the failure of the delamination of the silver glue bonded to the bottom of the single electrode, and the failure of the gold wire breakage. and problems such as colloid and substrate delamination

Method used

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  • Full-color SMD LED with enhanced waterproof performance
  • Full-color SMD LED with enhanced waterproof performance
  • Full-color SMD LED with enhanced waterproof performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Such as Figure 1 to 3 As shown, a full-color SMD LED that enhances waterproof performance includes a substrate 1, and is provided on the LED function zone 2 on the upper surface of the substrate 1, and the electrode 3 is provided on the lower surface of the substrate 1, and the package colloid 4 is provided on the substrate 1. The substrate 1 is located at the upper surface of the LED functional region 2, and the waterproof groove 5 is provided, the waterproof groove 5 is a concave tank structure, which is lower than the LED function zone 2, so the functional zone is equivalent to a boss, and when the mold is packaged. The glue is combined with three faces of each groove, and the encapsulation colloid 4 is embedded in the waterproof groove 5 to form a waterproof structure, effectively preventing moisture from directly entering the row from the lamp beads directly into the functional region. The substrate 1 is provided with a through hole of the LED function zone 2, the elec...

Embodiment 2

[0017] Such as Figure 1 to 3 As shown, a full-color SMD LED, which enhances waterproof performance, as in the example, the only difference is that the blind hole 9 does not plug the hole treatment, and the encapsulation colloid is injected through the front of the hole, and finally fill the entire blind. Hole 9.

[0018] The type of lamp beads used in the present invention includes a single separation device, a plurality of integrated devices.

[0019] The process steps of the present invention are as follows:

[0020] Step 1: The substrate 1 is processed;

[0021] Step 2: Substrate 1 plasma cleaning treatment;

[0022] Step 3: Substrate 1 solid crystal, welding wire or flip chip solid crystal;

[0023] Step 4: Sprinkling or vacuum coating is performed on the surface of the semi-finished LED functional region 2 using the Presin Gabani inorganic material mixture coating. The film layer of spray or vacuum vapor deposition is first cured, and the film layer after curing is optical tr...

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Abstract

The invention discloses a full-color SMD LED with enhanced waterproof performance, which comprises a substrate, an LED functional area arranged on the upper surface of the substrate, an electrode arranged on the lower surface of the substrate and a packaging colloid arranged on the upper surface of the substrate, and is characterized in that the upper surface of the substrate is provided with a waterproof groove at the periphery of the LED functional area, and the waterproof groove is of a concave groove structure; and the packaging colloid is embedded into the waterproof groove to form a waterproof structure, and the electrode seals the through hole on the lower surface of the substrate to form a blind hole. The waterproof groove is of a concave structure, the failure rate of dead light,electric leakage and the like of pixel points of the display screen after screen mounting is effectively reduced, and the production cost of the whole substrate is effectively reduced through the blind hole punching process.

Description

Technical field [0001] The present invention relates to the field of LED technology, in particular a full-color SMD LED that enhances waterproof performance. Background technique [0002] The traditional CHIP SMD LED substrate is not made of waterproof grooves around the ribbon, and the functional area and the non-functional zone are one flat overall. The front functional zone is connected to the back pin function zone, and the inner wall of the via hole is made to turn the front side to the back circuit. The through hole uses ink or resin pores. Water gas directly penetrates directly from the lamp bead and through holes, in the lighting state, cause the dual electrode chip electrode metal migration, leakage failure, silver glue stratification adhere to the bottom of the single electrode, and failure of the gold wire fracture And colloids and substrate layers. Inventive content [0003] The technical problem to be solved by the present invention is to improve the airtightness of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/62H01L25/075G09F9/33
CPCH01L33/486H01L33/54H01L33/62H01L25/0753G09F9/33
Inventor 欧锋李海张宏
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH
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