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Shielded gate field effect transistor and method for forming the same

A field effect transistor, shielded gate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problem of mutual restriction of turn-on voltage and leakage current, so as to overcome the mutual restriction of turn-on voltage and device leakage current, and improve the withstand voltage performance. , Improve the effect of leakage current

Active Publication Date: 2021-04-30
SEMICON MFG ELECTRONICS (SHAOXING) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a method for forming a shielded gate field effect transistor to solve the problem of mutual restriction between the turn-on voltage of the device and the leakage current phenomenon of the device

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  • Shielded gate field effect transistor and method for forming the same
  • Shielded gate field effect transistor and method for forming the same
  • Shielded gate field effect transistor and method for forming the same

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Embodiment Construction

[0031] As mentioned in the background, in the prior art, in order to reduce the turn-on voltage of the shielded gate field effect transistor, one method is to reduce the thickness of the gate oxide layer, and the other method is to reduce the ion concentration in the body region. However, this Both methods will cause leakage current phenomenon of the device while reducing the turn-on voltage of the device.

[0032] figure 1 It is a schematic diagram of the structure when the turn-on voltage is reduced by reducing the thickness of the gate oxide layer. Such as figure 1 As shown, by forming a thinner gate oxide layer 10, the formed shielded gate field effect transistor has a lower turn-on voltage. However, precisely because the required thickness of the gate oxide layer 10 is relatively thin, incomplete oxidation often occurs at the corner position 11 (for example, the sidewall at the corner position is difficult to fully contact with oxygen) when the oxidation process is perf...

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Abstract

The invention provides a shielded gate field effect transistor and a forming method thereof. The combination of thermal oxidation process and deposition process to prepare the gate oxide layer is beneficial to reduce the overall thickness of the gate oxide layer, and increase the thickness of the oxide layer at the corner based on the deposited oxide layer with high coverage performance, so that it can effectively overcome the existing technology The problem of mutual restriction between the device turn-on voltage and the device leakage current exists in the device, and the withstand voltage performance of the device is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a shielded gate field effect transistor and a forming method thereof. Background technique [0002] A shielded gate field effect transistor (Shielded Gate Trench, SGT) is more conducive to the flexible application of semiconductor integrated circuits because of its low gate-to-drain capacitance Cgd, very low on-resistance, and high withstand voltage performance. Specifically, in the shielded gate field effect transistor, by setting the shielding electrode below the gate electrode, the gate-to-drain capacitance can be greatly reduced, and the drift region of the shielded gate field effect transistor also has a relatively high impurity carrier Concentration, can provide additional benefits to the breakdown voltage of the device, which can reduce the on-resistance accordingly. [0003] In some application scenarios, a low voltage shielded gate field effect transistor is requ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/423H01L29/78H01L29/06
CPCH01L29/0603H01L29/0684H01L29/42356H01L29/4236H01L29/78
Inventor 袁家贵何云马平黄艳
Owner SEMICON MFG ELECTRONICS (SHAOXING) CORP