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Resin composition and application thereof

A resin composition and resin technology, applied in the direction of layered products, metal layered products, glass/slag layered products, etc., can solve the problems of low compressive strength, prone to broken balls, and poor dielectric properties. Achieve good compression performance, not easy to break the ball phenomenon, excellent dielectric properties

Active Publication Date: 2021-03-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is also the problem of low compressive strength, and broken balls are prone to occur during the manufacturing process of copper clad laminates, resulting in poor dielectric properties.

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] This embodiment provides a kind of resin composition, and described resin composition is made up of following components according to percentage by weight: resin 74.60wt%, curing agent 17.90wt%, accelerator 0.04wt%, hollow glass microsphere 7.46wt%, and The total mass of the resin composition is 100%.

[0044] In the above-mentioned formula, resin is brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), curing agent is novolak resin (Nippon Qunrong, hydroxyl equivalent 105 , product name TD2090), accelerator is 2-methylimidazole, and hollow glass microspheres are hollow glass microspheres A1.

[0045] The preparation method of above-mentioned resin composition is as follows:

[0046] Place the formulated amount of resin, curing agent, accelerator and hollow glass microspheres in a methyl ethyl ketone solvent, mechanically stir and emulsify to obtain a resin glue solution with a solid content of 65 wt%. ...

Embodiment 2-11

[0050] The difference with Example 1 is that the hollow glass microspheres are respectively hollow glass microspheres A2 (Example 2), A3 (Example 3), A4 (Example 4), A5 (Example 5), A6 (Example 4). Example 6), A7 (Example 7), A8 (Example 8), A9 (Example 9), A10 (Example 10) and A11 (Example 11).

Embodiment 12

[0052] The only difference with Example 1 is that the hollow glass microspheres are surface-treated hollow glass microspheres A2, and the surface treatment agent used in the surface treatment is a vinyl silane coupling agent (Shin-Etsu Chemical, product name KBM1003). The consumption of agent is 2% of hollow glass microsphere weight.

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Abstract

The present invention relates to a resin composition and an application thereof, the resin composition comprising a combination of a resin and hollow glass beads, the hollow glass beads having the following particle size distribution: D10 is greater than 8 [mu] m, D50 is 15-25 [mu] m, D90 is less than 40 [mu] m, and D100 is less than 60 [mu] m. According to the resin composition provided by the invention, the hollow glass beads with specific particle size distribution are added, and the hollow glass beads with different particle sizes are matched with each other, so that the resin compositionhas excellent dielectric property, the phenomenon of ball breaking is not easy to occur in the process of manufacturing the metal-clad foil plate, and the prepared copper-clad plate has better compression resistance.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a resin composition and its application. Background technique [0002] The development of modern high-frequency communication puts forward higher and higher requirements on the electrical properties of materials, especially low dielectric constant laminates for high frequency. Generally speaking, the effective dielectric constant of the composite material can be approximated as the weighted sum of the dielectric constant of each component and its volume fraction occupied in the composite material. Since most of the volume of the hollow glass microsphere is air (dielectric constant 1.2-2.0), it has a lower dielectric constant. In order to reduce the dielectric constant of the board, the most effective method is to add hollow fillers with low dielectric constants, such as hollow glass microspheres, to the glue formula. However, when the particle size of the hollow g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L71/12C08L9/06C08K9/06C08K7/28C08K7/14C08K5/14C08K7/18C08J5/24B32B15/14B32B15/20B32B17/04
CPCC08K9/06C08K7/28C08J5/24C08L71/12B32B15/14B32B15/20B32B5/02C08J2363/00C08J2371/12C08J2409/06C08K7/14C08K5/14C08K7/18C08K2201/003C08K2201/014B32B2262/101B32B2260/021B32B2260/046B32B2307/204B32B2307/50C08L63/00C08L9/06
Inventor 柴颂刚陈广兵郝良鹏
Owner GUANGDONG SHENGYI SCI TECH
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