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Polyimide precursor, polyimide film and preparation method thereof

A technology of polyimide precursor and polyimide film, applied in the field of polyimide precursor, polyimide film and its preparation, can solve the problem of not reaching panel manufacturers, reducing film temperature resistance, etc. problems, to achieve the effect of improving transparency, improving heat resistance, and improving coating uniformity

Pending Publication Date: 2021-03-26
武汉柔显科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The usual means of improving transparency in the prior art are: breaking large conjugated structures such as adding aliphatic monomers to monomers or replacing fluorine-free aromatic monomers with fluorine-containing aromatic monomers, but These two methods are based on the premise of reducing the temperature resistance of the film. At present, although there are some structures that can achieve a temperature resistance of about 400 ° C, they still cannot meet the requirements of panel manufacturers in the process of applying to panels.

Method used

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  • Polyimide precursor, polyimide film and preparation method thereof
  • Polyimide precursor, polyimide film and preparation method thereof
  • Polyimide precursor, polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] A 1L three-necked flask is equipped with mechanical stirring, a spherical condenser and a nitrogen guide head. Put 400g of NMP as a solvent into the three-necked flask, raise the temperature to 40°C, add 17.3026g of PDA, 6.8080g of ODA, and 1.9214g of TFMB into the flask, and use 50g of solvent Rinse, after completely dissolving, add 0.0396g sodium ascorbate and 18g solvent, react for 1 hour, add 29.4215g BPDA, rinse with 25g NMP solvent, control temperature at 40°C for 6h, then add 21.8120g PMDA, rinse with 25g NMP solvent, control After reacting at 40°C for 10 h, the polymerization reaction ended.

[0084] The performance test results of the obtained polyimide precursor solution Q1 are shown in Table 1.

[0085] Curing is carried out under a nitrogen atmosphere. The curing procedure is generally divided into at least two stages. The first stage is to raise the temperature to 220°C, and then keep it warm for 40 minutes. The second stage is to raise the temperature to 4...

Embodiment 2

[0088] A 1L three-necked flask equipped with mechanical stirring, a spherical condenser and a nitrogen guide head, put 400g of NMP as a solvent into the reaction flask, raise the temperature to 40°C, add 17.3026g of PDA, 6.8080g of ODA, and 1.9214g of TFMB into the flask, and use 50g of solvent Rinse, after completely dissolving, add 0.0220g hydroquinone and 18g solvent, react for 1 hour, add 29.4215g BPDA, wash with 25g NMP solvent, control temperature at 40°C for 6 hours, then add 21.8120g PMDA, use 25g NMP solvent Rinse, and control the temperature at 40°C for 10 hours to complete the polymerization reaction.

[0089] The performance test results of the obtained polyimide precursor solution Q2 are shown in Table 1.

[0090] The curing procedure is the same as that in Example 1, and the test results of the cured polyimide film M2 are shown in Table 2.

Embodiment 3

[0092] A 1L three-necked flask equipped with mechanical stirring, a spherical condenser and a nitrogen guide head, put 400g of NMP as a solvent into the reaction flask, raise the temperature to 40°C, add 17.3026g of PDA, 6.8080g of ODA, and 1.9214g of TFMB into the flask, and use 50g of solvent Rinse, after completely dissolving, add 0.2355g antioxidant 1010 and 18g solvent, react for 1 hour, add 29.4215g BPDA, wash with 25g NMP solvent, control temperature at 40°C for 6 hours, then add 21.8120g PMDA, wash with 25g NMP solvent , The polymerization reaction was completed after the temperature was controlled at 40° C. for 10 h.

[0093] The performance test results of the obtained polyimide precursor solution Q3 are shown in Table 1.

[0094] The curing procedure is the same as that in Example 1, and the test results of the cured polyimide film M3 are shown in Table 2.

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Abstract

The invention relates to a polyimide precursor, a polyimide film and a preparation method thereof. Specifically, the polyimide precursor is formed by reacting diamine A, dianhydride B and an additiveC under certain reaction conditions, wherein the mass of the fluorine-containing dianhydride or the fluorine-containing dianhydride does not exceed 5% of the mass of the total dianhydride and diamine,the light transmittance of the polyamide acid slurry is 65-67%, and when the thickness of a coating film is 10 microns, the uniformity of the thickness of the coating film is within 2%, the yellow index of the polyimide film is 21-22, the thermal expansion coefficient at 50-200 DEG C is 2-3 ppm / K, and the wavelength transmittance is 83-86%.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide precursor, a polyimide film and a preparation method thereof. Background technique [0002] As a special engineering plastic with imide ring and rigid chain structure in the main chain, polyimide has excellent mechanical properties, heat resistance, flame retardancy, solvent resistance, radiation resistance and electrical properties, and is widely used In a series of high-tech fields such as aerospace, optoelectronics, and automobiles. [0003] With the increase of people's demand for flexible wearable and foldable display devices, polyimide film materials with various advantages have become the key materials that people pay attention to. The high temperature resistance of the substrate material that has attracted much attention is due to the fact that many processes in the panel manufacturing process need to go through high temperature, such as laser cryst...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1067C08G73/1071C08G73/1039C08G73/1007C08J5/18C08J2379/08Y02E10/549
Inventor 肖桂林付华阮敏鲁丽平朱双全
Owner 武汉柔显科技股份有限公司
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