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A kind of two-component epoxy resin encapsulation glue and its preparation method and application

A technology of epoxy resin and encapsulating glue, which is applied in the direction of epoxy resin glue, adhesive, non-polymer adhesive additives, etc., can solve the problems of poor rheological stability, insufficient hanging glue, short pot life, etc. Achieve excellent rheological stability and viscosity stability, improve viscosity stability, rheological stability, and good rheological stability

Active Publication Date: 2022-04-01
SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The following problems usually exist in the existing two-component epoxy encapsulant. One is that the rheological stability of the encapsulant in the prior art is insufficient. The rheological additives of the existing encapsulant products include fumed silica and modified Fumed silica, organic bentonite, polyamide, etc. These rheological additives rely on the hydrogen bonding mechanism to achieve the purpose of controlling the rheology of the system, and this structure has limited effects in polar resins such as epoxy resins. During the storage, transportation and use of the product, the rheological properties of the glue are constantly changing, which often leads to insufficient hanging glue, flowing, and the product often needs to be reworked; second, the pot life is too short, and the pot life is only 1-2 days after the two components are mixed. Hours later, rheological stability will deteriorate, resulting in insufficient hanging glue and flowing, resulting in serious waste of encapsulating glue, seriously affecting production efficiency, and often causing the entire motor to be scrapped due to glue flowing into the commutator slot

Method used

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  • A kind of two-component epoxy resin encapsulation glue and its preparation method and application
  • A kind of two-component epoxy resin encapsulation glue and its preparation method and application
  • A kind of two-component epoxy resin encapsulation glue and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] This example provides a two-component epoxy resin encapsulant, which includes component A and component B.

[0040] Among them, the raw materials of component A include 40 kg E54 bisphenol A epoxy resin, 40 kg E51 bisphenol A epoxy resin, 4 kg Span-80, 4 kg EL-10, 1 kg fumed silica, 18.5 kg Wollastonite, 0.5 kg rheology additive, 0.1 kg defoamer;

[0041] The raw materials of component B include 48 kg of methyltetrahydrophthalic anhydride, 0.2 kg of fumed silica, 0.2 kg of modified curing accelerator, 0.2 kg of rheology additive, and 25 g of defoamer.

[0042] The preparation method of described two-component epoxy resin encapsulant comprises the steps:

[0043] Preparation of A component:

[0044] Preparation of modified epoxy resin: heat 20 kg of E54 bisphenol A epoxy resin and 20 kg of E51 bisphenol A epoxy resin, and raise the temperature to 210±5°C, then add 4 kg of Span-80 and 4 kg of EL -10, and stir evenly; keep the system temperature at 210±5°C for 60 minute...

Embodiment 2

[0050] This example provides a two-component epoxy resin encapsulant, which includes component A and component B.

[0051] Among them, the raw materials of component A include 80 kg of E54 bisphenol A epoxy resin, 4 kg of EL-10, 4 kg of EL-20, 1 kg of fumed silica, 18.5 kg of wollastonite, 0.5 kg of rheological additives, 0.1 kg of defoamer;

[0052] The raw materials of component B include 48 kg of methyl hexahydrophthalic anhydride, 0.2 kg of fumed silica, 0.2 kg of modified curing accelerator, 0.2 kg of rheology additive, and 25 g of defoamer.

[0053] The preparation method of described two-component epoxy resin encapsulant comprises the steps:

[0054] Preparation of A component:

[0055] Preparation of modified epoxy resin: Heat 40 kg of E54 bisphenol A epoxy resin to 210±5°C, then add 4 kg of EL-10 and 4 kg of EL-20, and stir evenly; keep the system temperature at React at 210±5°C for 60 minutes, then add the remaining epoxy resin; keep the system temperature at 210±...

Embodiment 3

[0061] This example provides a two-component epoxy resin encapsulant, which includes component A and component B.

[0062] Among them, the raw materials of component A include 80 kg of E51 bisphenol A epoxy resin, 4 kg of Span-80, 4 kg of Span-20, 1 kg of fumed silica, 18.5 kg of wollastonite, and 0.5 kg of rheological aids. agent, 0.1 kg of defoamer;

[0063] The raw materials of component B include 24 kg of methyl tetrahydrophthalic anhydride, 24 kg of tung oil anhydride, 0.2 kg of fumed silica, 0.2 kg of modified curing accelerator, 0.2 kg of rheology additive, and 25 g of defoamer.

[0064] The preparation method of described two-component epoxy resin encapsulant comprises the steps:

[0065] Preparation of A component:

[0066] Preparation of modified epoxy resin: Heat 40 kg of E51 bisphenol A epoxy resin to 210±5°C, then add 4 kg of Span-80 and 4 kg of Span-20, and stir evenly; keep the system React at 210±5°C for 60 minutes, then add the remaining epoxy resin; keep t...

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Abstract

The invention discloses a two-component epoxy resin encapsulant and its preparation method and application. It includes component A and component B. The component A includes a modified epoxy resin, a first thixotropic agent, and a filler. Component B includes acid anhydride curing agent and modified curing accelerator. Modified epoxy resin is made by reacting oil-soluble nonionic surfactant with epoxy resin. The oil-soluble nonionic surfactant is sorbitan fatty acid ester (Span) and / or castor oil polyoxyethylene ether; the modified curing accelerator is made by the reaction of fatty alcohol polyoxyethylene ether phosphate and amine curing accelerator; its preparation is by combining the components in the respective components It can be made by mixing; the two-component epoxy encapsulant has excellent rheological stability, viscosity stability and long pot life, and is suitable for use as an encapsulant in motors.

Description

technical field [0001] The invention belongs to the technical field of electronic sealants, and in particular relates to a two-component epoxy resin encapsulant and its preparation method and application. Background technique [0002] When the motor is working, due to high speed, high vibration, high load and other harsh working conditions, the service life of the motor is affected, which has strict requirements on the motor, especially its high-speed rotor structure; the rotor neck commutator is connected to the winding The part (rotor neck) is the weak link of the whole motor. In the industry, this part is usually fixed with adhesive to increase its anti-vibration and anti-broken ability, and increase the reliability of the whole motor. [0003] The following problems usually exist in the existing two-component epoxy encapsulant. One is that the rheological stability of the encapsulant in the prior art is insufficient. The rheological additives of the existing encapsulant ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J187/00C09J11/04C08G59/68C08G59/14C08G59/16C08G81/00
CPCC09J163/00C09J187/005C09J11/04C08G59/688C08G59/14C08G59/1455C08G81/00C08K3/36C08K3/34Y02E10/50
Inventor 潘德忠井丰喜吴斌张春琪张超周林江顾健峰
Owner SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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