High-speed laser

A laser, high-speed technology, used in lasers, laser parts, semiconductor lasers, etc., can solve the problems of low thermoelectric conversion rate, small cooling temperature difference between cold end and hot end, and low cooling efficiency.

Inactive Publication Date: 2021-04-27
深圳市利拓光电有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, this structure only uses a thermoelectric cooler to control the working temperature of the laser emitter, and one of the shortcomings of the existing thermoelectric cooler is that the thermoelectric conversion rate is low, the cooling temperature difference between the cold end and the hot end is small, and the cooling efficiency is low.

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Embodiment Construction

[0025] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0026] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected ...

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Abstract

The invention discloses a high-speed laser. The high-speed laser comprises a shell, a laser chip heat sink, a laser chip, a backlight detection chip, a detection chip heat sink and a thermoelectric refrigerator are arranged in the shell, a tube socket and a tube cap are coaxially packaged in the shell, one side of the thermoelectric refrigerator is arranged on the tube socket, the other side is arranged below the substrate,the detection chip heat sink and the thermistor are arranged above the substrate, the laser chip is attached to the laser chip heat sink, and the backlight detection chip is attached to the detection chip heat sink; and the thermoelectric refrigerator comprises a semiconductor refrigeration sheet, a heat conduction sheet and a heat dissipation sheet, the conductor refrigeration sheet is fixed between the heat conduction sheet and the heat dissipation sheet, and both the space between the semiconductor refrigeration sheet and the heat conduction sheet and the space between the semiconductor refrigeration sheet and the heat dissipation sheet are filled with insulating heat conduction colloid, so that the refrigeration effect is improved, the chirp effect is avoided, and high-speed, long-distance and stable-wavelength transmission of the laser is realized.

Description

technical field [0001] The invention belongs to the technical field of optical communication devices, in particular to a high-speed laser. Background technique [0002] Semiconductor laser is a light source device in optical fiber communication, which has the characteristics of direct electro-optic conversion, fast response, small size, and long life. There are mainly two modulation methods of semiconductor laser signals: direct modulation laser (DFB laser) and external modulation laser (EML laser). Directly modulated laser is to modulate the output of laser by changing the input current. DFB laser has become the main light source in optical fiber communication due to its characteristics of dynamic single mode and fast response. [0003] Usually, if the temperature of the DFB laser is not controlled, the chirp effect is likely to occur, and it is difficult to achieve wavelength division multiplexing to achieve long-distance transmission. The existing semiconductor laser ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/02212H01S5/024
CPCH01S5/02212H01S5/02415
Inventor 焦英豪毛森陆凯凯毛融田
Owner 深圳市利拓光电有限公司
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