ABS improved hollow plate and preparation method thereof

Abstract

The invention discloses an ABS improved hollow plate and a preparation method thereof. The hollow plate provided by the invention is prepared from the following components in parts by weight: 60 to 80 parts of ABS resin, 18 to 40 parts of PMMA resin, 0.5 to 2 parts of an antibacterial agent and 0.3 to 3 parts of an antioxidant. The material of the hollow plate is improved, proper hardness and brittleness temperature resistance are guaranteed, meanwhile, mass molecule arrangement of internal materials is studied, the ABS resin contains side phenyl, cyano and unsaturated double bonds, PMMA has polar side methyl and ester groups, and beneficial conditions are provided for blending grafting of ABS resin and PMMA. Internal mass molecule arrangement and hardness are improved, and wire clamping caused by plastic sheet cutting due to deformation of the plate after high temperature is avoided.

Description

technical field [0001] The invention relates to the field of materials, in particular to an ABS improved hollow board and a preparation method thereof. Background technique [0002] In the current cost structure, the proportion of line liquid cost is gradually decreasing, the marginal effect of traditional control to reduce line liquid cost is prominent, and the effect is getting weaker and weaker, while the proportion of auxiliary materials to cost is gradually increasing, especially monocrystalline silicon wafers. Studying the cutting shape of diamond wire in the process of cutting single crystal silicon wafers on LC special machine, it is found that cutting has a great impact on the yield rate, and the yield rate affects the cost to a large extent. In order to solve the problem of cutting yield rate, the existing technology Hollow cutting boards are usually used, and a square cavity is added to the cutting board to form a hollow board. The use of a hollow structure reduce...

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Problems solved by technology

[0002] In the current cost structure, the proportion of line liquid cost is gradually decreasing, the marginal effect of traditional control to reduce line liquid cost is prominent, and the effect is getting weaker and weaker, while the proportion of auxiliary materials to cost is gradually increasing, especially monocrystalline silicon wafers. Studying the cutting shape of diamond wire in the process of cutting single crystal silicon wafers on LC special machine, it is found that cutting has a great impact on the yield rate, and the yield rate affects the cost to a large extent. In order to solve the problem of cutting yield rate, the existing technology Hollow cutting boards are usually used, and a square cavity is added to the cutting board to form a hollow board. The use of a hollow structure reduces the cost of materials by more than 30%. The high-quality rate of the chip can effectively improve the production efficiency, but the existing hollow plate adopts a square cavity, which is easy to cause the diamond wire to get stuck during cutting, which affects the cutting efficiency.

[0003] In addition, most of the backing boards used for diamond wire silicon wafer cutting are polyester and plastic: the specificity of polyester backing boards is 1.5-2.0g / cm 3 , prone to breakage, broken wires, sticky wires, high cutting rate and inconvenient recycling of silicon materials and backing boards; the specific gravity of plastic boards is relatively light, at 1-1.2g / cm 3 , but the cost is high, these problems make it impossible to reduce the cost and improve the production efficiency when the product is manufactured

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