Method for manufacturing high-density interconnection circuit board

Abstract

The invention discloses a method for manufacturing a high-density interconnection circuit board. The method comprises the steps of S1, cutting, S2, copper column electroplating, S3, core board manufacturing, S4, pressing, S5, grinding and S6, circuit manufacturing. According to the method for manufacturing the high-density interconnection circuit board, the manufacturing method is simple, conduction of any layer can be achieved, and the production efficiency is improved; and the method for electroplating the copper column has the advantages of no generation of recesses, easy realization of a structure of combining holes on holes and hole discs, high alignment precision, and realization of accurate control of the copper thickness of each layer of circuit by adopting a semi-additive method to manufacture the pattern circuit, realization of more precise circuit manufacture, and guarantee of the product quality.

Description

Technical field[0001]The present invention relates to the technical field of PCB plate making, in particular a method for making a high density interconnect circuit board.Background technique[0002]The PCB (Printed Circuit Board), the Chinese name is a printed circuit board, also known as the printed circuit board, is an important electronic component, is a support of the electronic component, and is an electrical connection of electronic components. Since it is made of electronic printing, it is called a "print" circuit board. The high-density interconnect circuit board conventional conduction process is to use a drilling + electroplating to achieve an inter-stationary, which has the following shortcomings for making high-multi-layer high-density interconnect circuit board products:[0003]1. High-multi-layer high-density interconnect line board product process is cumbersome, low production efficiency;[0004]2, high-multi-layer high-density interconnect line board product production is...

AI Technical Summary

Problems solved by technology

[0003] 1. The manufacturing process of high-layer high-density interconnection circuit board products is cumbersome and complicated, and the production efficiency is low;

[0004] 2. The alignment accuracy between layers is insufficient during the production of high-multilayer high-density interconnection circuit board products, which is prone to process scrapping;

[0005] 3. The reliability of the product cannot be fully guaranteed, and it is easy to cause the client to be scrapped

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