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A high-precision and high-efficiency ultrafast laser processing method for micro-holes with large depth-to-diameter ratio

An ultra-fast laser and processing method technology, which is applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., to achieve the effect of improving processing efficiency, avoiding influence, and large depth-to-diameter ratio

Active Publication Date: 2021-10-01
TSINGHUA UNIV +1
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Problems solved by technology

[0006] The present invention aims to solve at least one of the technical problems existing in the existing processing technology or related processing technology

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  • A high-precision and high-efficiency ultrafast laser processing method for micro-holes with large depth-to-diameter ratio
  • A high-precision and high-efficiency ultrafast laser processing method for micro-holes with large depth-to-diameter ratio

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0027] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention relates to a high-precision and high-efficiency ultrafast laser processing method for micro-holes with a large depth-to-diameter ratio, which belongs to the technical field of high-precision intelligent laser manufacturing, and applies high-precision laser space shaping technology and high-efficiency process judgment control method to micro The shape repair of deep through-holes can improve the shape quality and processing efficiency of micro-holes. The method is: set the corresponding laser processing technology according to the material properties and processing technology requirements; use Gaussian laser to drill holes in the target; use real-time monitoring The device monitors the target, and when the target is penetrated, the laser energy distribution is converted from a Gaussian type to a flat-top type; the flat-top laser is used to repair the shape of the microhole; the real-time monitoring device is used to monitor the shape of the microhole outlet to meet the requirements When the next micro-hole processing. The invention adopts the combination of Gaussian laser processing and flat-top laser repairing, real-time monitoring and feedback control of the processing method of the processing flow, and effectively improves the processing quality and processing efficiency of microholes.

Description

technical field [0001] The invention is oriented to a high-precision and high-efficiency ultrafast laser processing method for microholes with a large depth-diameter ratio, and belongs to the technical field of high-precision intelligent laser manufacturing. It applies high-precision laser space shaping technology and high-efficiency process judgment control method to micro-depth channels The shape repair of the hole improves the shape quality and processing efficiency of the microhole. Background technique [0002] Laser micro-nano manufacturing is one of the frontiers and important development directions of mechanical manufacturing technology, providing important technical support for processing and manufacturing in my country's aerospace, national defense, energy, automobile, biology, medical and many other fields. Laser micro-hole manufacturing is the best solution to break through many key core technologies and solve key problems in the above-mentioned industrial fields...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/60B23K26/70
CPCB23K26/382B23K26/60B23K26/70
Inventor 张震杨伟管迎春
Owner TSINGHUA UNIV
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