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Corona solder-resistant circuit board and preparation method thereof

A circuit board and solder resist technology, which is applied in printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems affecting the quality of circuit boards, oil rejection, PTFE material is easy to be collided, etc., and achieve good solder resist printing effect , enhance the bonding force, and improve the efficiency of spraying solder mask

Pending Publication Date: 2021-05-07
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, PTFE materials are vulnerable to collisions during the production process of solder masking. Subtle changes will occur on the surface of PTFE materials after the collision, and oil throwing problems often occur during soldering masking, which affects the quality of the circuit board.

Method used

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  • Corona solder-resistant circuit board and preparation method thereof
  • Corona solder-resistant circuit board and preparation method thereof
  • Corona solder-resistant circuit board and preparation method thereof

Examples

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preparation example Construction

[0030] The present application provides a method for preparing a corona solder resist circuit board. The preparation method of the above-mentioned corona solder resist circuit board includes the following steps: performing a pretreatment operation on the board material of the circuit board; performing a corona treatment operation on the board material of the circuit board to obtain a board material of the corona circuit board; The plate of the circuit board is subjected to the solder resist spraying operation to obtain the plate of the solder resist circuit board; the plate of the solder resist circuit board is subjected to exposure and development operations; the plate of the solder resist circuit board after the exposure and development operations are completed is subjected to Baking operation to obtain the corona solder resist circuit board.

[0031] The preparation method of the above-mentioned corona solder resist circuit board is to corona-treat the plate of the circuit ...

Embodiment 1

[0060] The PTFE sheet is selected as the board of the circuit board, and the PTFE sheet is subjected to super-roughening treatment. Then corona treatment is carried out to the treated PTFE sheet, wherein the voltage during the corona treatment is 8000V, the discharge power is 200W, the discharge gap is 1mm, and the processing line speed is 1.5m / min. After the corona treatment is completed on the PTFE sheet, use a low-pressure spraying method to atomize the ink through a spray gun and then spray it on the surface of the circuit board. After spraying evenly, let it stand for 25 minutes, and then spray the sprayed circuit board Pre-baking at 60° C. for 25 minutes, and then exposing and developing the solder resist circuit board. After the exposure and development operations are completed, the plate of the solder resist circuit board is baked in sections, sequentially baked at 80°C for 1 hour, baked at 100°C for 0.5 hour, and baked at 120°C for 0.5 hour. After the baking is compl...

Embodiment 2

[0062] The PTFE sheet is selected as the board of the circuit board, and the PTFE sheet is subjected to super-roughening treatment. Then corona treatment was performed on the treated PTFE sheet, wherein the voltage during the corona treatment was 12000V, the discharge power was 1200W, the discharge gap was 2mm, and the processing line speed was 3.0m / min. After the corona treatment is completed on the PTFE sheet, use the low-pressure spraying method to atomize the ink through the spray gun and then spray it on the surface of the board of the circuit board. Pre-baking at 70° C. for 30 minutes, and then exposing and developing the solder resist circuit board. After the exposure and development operations are completed, the plate of the solder resist circuit board is baked in sections, sequentially baked at 90°C for 1 hour, baked at 110°C for 0.5 hour, and baked at 130°C for 0.5 hour. After the baking is completed, a corona solder resist circuit board is obtained.

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Abstract

The invention provides a corona solder-resistant circuit board and a preparation method thereof. The preparation method of the corona solder-resistant circuit board comprises the steps of carrying out pretreatment operation on the board of the circuit board; performing corona treatment operation on the board of the circuit board to obtain the board of a corona circuit board; performing solder mask spraying operation on the board of the corona circuit board to obtain the board of a solder-resistant circuit board; performing exposure and development operation on the board of the solder-resistant circuit board; and carrying out baking operation on the board of the solder-resistant circuit board after exposure and development operations are completed to obtain the corona solder-resistant circuit board. The preparation method of the corona solder-resistant circuit board can effectively enhance the binding force of the board and the ink of the circuit board and improve the solder-resistant efficiency.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a corona solder resist circuit board and a preparation method thereof. Background technique [0002] As the carrier frequency of 5G communication increases, the wavelength becomes shorter and the signal coverage becomes smaller, which requires more base stations, antennas and other equipment. It is estimated that the number of base stations and other equipment in the 5G era is more than 10 times that of the 4G era. Smart terminals also need to be replaced in order to enjoy the new experience brought by the 5G network. By 2022, the global investment in 5G mobile communication base stations is expected to reach 15 billion U.S. dollars, and the domestic investment is expected to reach 5 billion U.S. dollars, which will bring explosive growth to the printed circuit board (PCB) industry. In terms of PCB material selection for 5G equipment, polytetrafluoroethy...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/0011H05K1/02
Inventor 许校彬肖尊民
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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