Wedge-shaped chopper for strip bonding and machining method of wedge-shaped chopper

A wedge-shaped, chopper technology, applied in the direction of electrical components, electrical solid devices, semiconductor/solid device manufacturing, etc., to achieve consistent bonding strength, smooth perforation, and long service life

Pending Publication Date: 2021-05-11
GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Especially for microwave devices with high operating frequency and high reliability, it is necessary to realize high-density, multi-layer, and multi-chip assembly mic

Method used

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  • Wedge-shaped chopper for strip bonding and machining method of wedge-shaped chopper
  • Wedge-shaped chopper for strip bonding and machining method of wedge-shaped chopper
  • Wedge-shaped chopper for strip bonding and machining method of wedge-shaped chopper

Examples

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Effect test

Embodiment 1

[0052] A wedge-shaped riving knife with an overall structure for strip bonding, with a length of 12mm, including two parts: a handle 1 and a head 2. The cutting surface 123 and the flat notch surface 124 make a transition, the angle between the first beveled surface 121, the second beveled surface 122, and the third beveled surface 123 is consistent with the knife handle 1, and the angle is 2°; the knife handle 1 is a flat notched cylinder , the shank diameter is 1.5mm, the shank diameter tolerance is ≤±5μm, the radial length of the flat notch is 1.3mm, and the radial length tolerance of the flat notch is (-0.01, 0); the center of the shank 1 is provided with a straight lead circle through The hole 11 has a diameter of 0.20 mm, dimensional tolerance ≤ ± 5 μm, concentricity ≤ ± 5 μm, surface roughness ≤ 1.0 μm; the cutter head 2 is a wedge-shaped structure, consisting of a first beveled surface 121, a plane 23, and a third beveled surface 123 , the fourth chamfered surface 21 a...

Embodiment 2

[0056] A wedge-shaped riving knife with an overall structure for strip bonding, with a length of 40mm, including two parts: a handle 1 and a head 2. The handle 1 and the head 2 pass through a first inclined plane 121, a second inclined plane 122, and a third The cutting surface 123 is transitioned to the flat notch surface 124, and the angle between the first beveled surface 121, the second beveled surface 122, and the third beveled surface 123 is consistent with the knife handle 1, and the included angle is 30°; the knife handle 1 is a flat notched cylinder , the shank diameter is 2.5mm, the shank diameter tolerance is ≤±5μm, the radial length of the flat notch is 2.3mm, and the radial length tolerance of the flat notch is (-0.01, 0); the center of the shank 1 is provided with a straight lead circle The hole 11 has a diameter of 0.55 mm, dimensional tolerance ≤ ± 5 μm, concentricity ≤ ± 5 μm, surface roughness ≤ 1.0 μm; the cutter head 2 is a wedge-shaped structure, composed o...

Embodiment 3

[0060] A wedge-shaped riving knife with an overall structure for strip bonding, with a length of 19.05mm, including two parts: a handle 1 and a cutter head 2. The beveled surface 123 and the flat notch surface 124 make a transition, and the first beveled surface 121, the second beveled surface 122, and the third beveled surface 123 are consistent with the included angle of the knife handle 1, and the included angle is 10°; the knife handle 1 is a flat notch type Cylindrical, shank diameter is 1.586mm, shank diameter tolerance ≤±5μm, flat notch radial length is 1.5mm, flat notch radial length tolerance is (-0.01, 0); shank 1 center is provided with a through straight lead The round hole 11 has a diameter of 0.45 mm, a dimensional tolerance of ≤±5 μm, a concentricity of ≤±5 μm, and a surface roughness of ≤1.0 μm; the cutter head 2 is a wedge-shaped structure, composed of a first beveled surface 121, a plane 23, and a third beveled surface 123. The fourth beveled surface 21 and t...

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Abstract

The invention discloses a wedge-shaped chopper for strip bonding and a machining method of the wedge-shaped chopper. The wedge-shaped chopper is of an integrated structure and comprises a chopper handle and a chopper head, the chopper handle is a flat notch type cylinder, the chopper head is of a wedge-shaped structure, and the transition from the chopper handle to the chopper head is realized through a first diagonal plane, a second diagonal plane, a third diagonal plane and a flat notch plane. A through straight lead round hole is formed in the center of the cutter handle, a through inclined lead square hole is formed in the cutter head, and the cutter head comprises a first diagonal plane, a plane, a third diagonal plane, a fourth diagonal plane and an end face. The end face comprises a front fillet face, a bonding face, a rear fillet face, a groove and a first inclined face, and the groove is formed in the bonding face. The wedge-shaped chopper for strip bonding and the machining method of the wedge-shaped chopper are suitable for hot ultrasonic wedge-shaped welding bonding of narrow-spacing, high-density, deep-cavity and multi-cavity strips, and the requirements that strip perforation is smooth, ultrasonic transmission is free of vibration, the bonding strength meets the use requirement and the service life is long are met. And a key tool guarantee is provided for lead bonding of microwave device and microwave chip assembly.

Description

technical field [0001] The invention belongs to the field of microelectronic tools, and in particular relates to a wedge-shaped chopper for bonding strips and a processing method thereof. Background technique [0002] Wire bonding is to use a wedge-shaped rivet to transmit ultrasonic energy, so that the bonding wire passing through the rivet generates pressure and friction between the rivet cutter head and the pad metal, so that it can be tightly welded to the substrate pad, and realize the bond between the chip and the substrate. Electrical interconnection and information exchange between chips. As the line width of integrated circuits continues to shrink, it has reached 0.018 μm in 2018 from 0.057 μm in 2008. Correspondingly, the pad spacing of wire bonding is reduced from 35 μm to 20 μm, which puts forward fine pitch and high reliability requirements for wire bonding technology. In view of the small lead area at the wedge-shaped solder joint, the small pad spacing and t...

Claims

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Application Information

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IPC IPC(8): H01L21/607B23P15/00
CPCB23P15/00H01L24/77H01L2224/77343
Inventor 谢兴铖曹瑞军林中坤杨剑梁秋实史植广刘皓
Owner GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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