Device for testing power-on heating performance of high-power semiconductor device

A heat generation performance and testing device technology, which is applied in the direction of single semiconductor device testing, measuring devices, instruments, etc., can solve problems such as large fluctuations in inlet water temperature, inaccurate test temperature, inaccurate performance testing of high-power semiconductor device IGBT, etc.

Active Publication Date: 2021-05-18
普世通(北京)电气有限公司
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Problems solved by technology

[0004] However, my country's high-power semiconductor device IGBT started relatively late, and the design of domestic IGBT has not been verified by long-term operation tests. At present, the performance test equipment for high-power semiconductor devices generally adopts slotted thermocouples and simple water system cooling. Inaccurate and large fluctuations in water temperature lead to inaccurate IGBT performance testing of high-power semiconductor devices, resulting in inability to fully and reliably test IGBT performance

Method used

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  • Device for testing power-on heating performance of high-power semiconductor device
  • Device for testing power-on heating performance of high-power semiconductor device
  • Device for testing power-on heating performance of high-power semiconductor device

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Embodiment approach

[0039] In addition, if figure 1 As shown, according to an embodiment of the present invention, it also includes a smart display 6 electrically connected to the semiconductor device unit 1, the size of the smart display 6 is not less than 12 inches, and the smart display 6 has internal data processing and data storage. And the test data playback function, the intelligent display screen 6 can display the temperature change curve and temperature data of the IGBT device under different working conditions. The smart display screen 6 has a U disk interface function, and the test record data can be transmitted through the U disk.

[0040] According to the above solution of the present invention, a method for arranging thermocouples for temperature measurement integrated with elastic top pressure is proposed, which effectively ensures good contact between the thermocouples and the surface of the radiator, and greatly improves the accuracy of temperature measurement and the consistency...

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Abstract

The invention relates to a device for testing the power-on heating performance for a high-power semiconductor device, and the testing device comprises a semiconductor device unit, a heat dissipation unit which can be in contact with the semiconductor device unit for the heat dissipation of the semiconductor device, a temperature measurement unit which is connected with the heat dissipation unit and is used for detecting the temperature of the heat dissipation unit, a driving unit which is connected with the heat dissipation unit and the temperature measurement unit and used for driving the heat dissipation unit to be in contact with the semiconductor device unit, and an intelligent temperature control water cooling unit which is connected with the heat dissipation unit and used for intelligently controlling the heat dissipation unit to dissipate heat of semiconductor devices in the semiconductor device unit. According to the scheme of the invention, sound contact between a thermocouple and the surface of a radiator is effectively ensured, and the temperature measurement accuracy and the consistency of measurement results are greatly improved. Intelligent temperature control and adjustment of the inlet water temperature are achieved, the problem of wide fluctuation of the inlet water temperature is solved, the frequency conversion water pump does not need to be closed when the IGBT device is replaced, and the test efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of thermal control of electronic components, in particular to a device for testing the heat generation performance of high-power semiconductor devices. Background technique [0002] Flexible DC transmission has extensive technical requirements in my country, and is an important means to realize large-scale renewable energy grid integration and improve the control level of complex power grids. The flexible DC power transmission converter valve is the core equipment to realize the conversion of AC and DC power. Due to the increasing transmission capacity of flexible direct current transmission projects, the requirements for the reliability of converter valve operation are extremely high. [0003] The converter valve has a high voltage level and large conversion power. During operation, the high-power semiconductor device IGBT generates huge heat, which is transmitted to the cooling water circuit through a mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 陈伟渠学景李建丁小刚黄新宇
Owner 普世通(北京)电气有限公司
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