Silicon photonic package structure
A packaging structure, silicon photonics technology, applied in optics, light guides, optical components, etc., can solve the problems of entering the laser resonant cavity, the size of the microlens is too large, and the cost of the product increases.
Active Publication Date: 2021-05-18
IND TECH RES INST
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Problems solved by technology
In addition, in the prior art, the incident surface of the beam is not treated, so it is easy to cause the reflection of the beam, and cause additional light to enter the laser cavity through reflection
Furthermore, in the prior art, the microlenses are processed in an assembled manner, so the alignment accuracy needs to be accurately defined, and the volume of the microlenses is too large, and additional components will increase the product cost
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[0042] Figure 1A It is a three-dimensional schematic diagram of the silicon photonics packaging structure according to an embodiment of the present invention before the laser diode is assembled on the substrate, and Figure 1B for Figure 1A A schematic cross-sectional view of the silicon photonics packaging structure. Figure 2A for Figure 1A An enlarged schematic view of region A in, Figure 2B for Figure 1A An enlarged schematic view of region B in, Figure 2C for Figure 1A An enlarged schematic view of region C in , while Figure 2D for Figure 1A Schematic cross-sectional view of region E in . Please refer to Figure 1A and Figure 1B , the silicon photonics packaging structure 100 includes a substrate 110 , a conductive bump 120 , a wall structure 130 , a laser diode 140 , a mode converter 150 and a spherical lens 160 . The conductive bump 120 is disposed on the substrate 110 , and the barrier structure 130 is formed on the substrate 110 . In this embodiment, th...
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Abstract
The invention discloses a silicon photonic package structure, including a substrate, a conductive bump, an obstacle structure, a laser diode, a mode converter, and a ball lens. The conductive bump is disposed on the substrate. The obstacle structure is formed on the substrate. The laser diode is disposed above the substrate and electrically bonded to the conductive bump. A surface of the laser diode facing the substrate has a ridge. An end of the ridge has a light-emitting surface. The obstacle structure is located between the conductive bump and the ridge. A thickness of the obstacle structure in a direction perpendicular to the surface of the substrate is greater than a thickness of the ridge in the direction perpendicular to the surface of the substrate. The mode converter is formed on the substrate. The ball lens is formed on the substrate and located between the light-emitting surface and a light input end of the mode converter.
Description
technical field [0001] The present invention relates to a package structure, and in particular to a silicon photonic package structure. Background technique [0002] Since optical signals transmitted in optical fibers can be transmitted over longer distances with lower distortion than electrical signals transmitted in cables, optical communication has developed vigorously in recent years. In addition, the introduction of silicon photonics (siliconphotonics) technology into the field of optical communication has the advantages of cheap materials, mature manufacturing technology (line width can be less than 20 nanometers), and integration of optoelectronic chips. Furthermore, if the manufacturing process is fully developed, the cost of the chip can be reduced and the yield rate can be high. [0003] However, when using silicon photonics technology, the light source needs to be integrated heterogeneously, and the cost of packaging and testing is much greater than the cost of c...
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IPC IPC(8): G02B6/42G02B6/32
CPCG02B6/4206G02B6/4283G02B6/32G02B6/4232G02B6/12G02B2006/12152G02B2006/12061G02B2006/12121G02B6/14
Inventor 陈玮晏温新助陈尚骏
Owner IND TECH RES INST