Silicon wafer processing device and processing technology for chip preparation

A technology for processing devices and silicon wafers, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as temperature softening deformation, clamping device offset, and lack of silicon wafer 4, so as to prevent softening and deformation Effect
CN112838045AInactive Publication Date: 2021-05-25六安优云通信技术有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
六安优云通信技术有限公司
Publication Date
2021-05-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to the technical field of silicon wafer processing devices, and discloses a silicon wafer processing device and processing technology for chip preparation. A silicon wafer is polished through a polishing disc, a booster pump is started, water in a water tank is discharged into a water inlet pipe and then is discharged into the booster pump through the water inlet pipe, and cooling liquid is discharged into the water outlet pipe through the pressurization effect of the booster pump and finally is sprayed out through a porous nozzle, so the water cooling effect on the silicon wafer is realized during polishing. A coupling drives an input shaft to rotate, the input shaft drives a first driving belt wheel and a second driving belt wheel to rotate, a first driving belt wheel and a second driving belt wheel respectively drive a first driven belt wheel and a second driven belt wheel to rotate through a first transmission belt and a second transmission belt, so that a first rotating shaft and a second rotating shaft rotate, two cooling fans rotate, chippings generated during grinding can be treated through rotation of the cooling fans, and chippings are prevented from influencing the polishing sight.
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Description

technical field

[0001] The invention relates to the technical field of silicon wafer processing devices, in particular to a silicon wafer processing device and processing technology for chip preparation. Background technique

[0002] Elemental silicon is a gray, brittle, tetravalent non-metallic chemical element. 27.8% of the earth's crust is composed of silicon, second only to oxygen. Silicon is a relatively abundant element in nature. Silicon can be found in , agate, flint and ordinary beach rocks. Silicon wafers, also known as wafers, are processed from silicon ingots. Millions of particles can be etched on silicon wafers through special processes. Transistors are widely used in the manufacture of integrated circuits. Silicon is a semiconductor material, and its own conductivity is not very good. However, its resistivity can be precisely controlled by adding appropriate dopants. Before manufacturing semiconductors, it must Converting silicon into wafers begins with the g...

Claims

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