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Separation and release of laser-processed brittle material

A brittle material and laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as cracking of the inner edge of the workpiece

Active Publication Date: 2021-05-25
相干慕尼黑有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the angled hole is further stressed, the release can cause the inner edge of the part to crumble

Method used

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  • Separation and release of laser-processed brittle material
  • Separation and release of laser-processed brittle material
  • Separation and release of laser-processed brittle material

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0022] Referring now to the drawings, wherein like parts are represented by like numerals, Figure 1A and 1B The device 10 used in the prior art laser cutting method is schematically shown and is also used in the separation and release method of the present invention. In both the prior art method and the current method, a workpiece 12 made of a brittle material is exposed to a focused beam 14 of pulsed laser radiation. Focusing of the pulsed laser radiation beam 14 is indicated by converging rays 16A and 16B, representing boundary rays of the focused laser radiation beam. Pulsed laser radiation beam 14 is produced by pulsed laser radiation source 18 and has a wavelength that renders brittle materials transparent. The pulsed laser radiation beam 14 is a beam of repeating single laser pulses (only three shown here) or trains of repeating laser pulses. Each pulse or train of pulses creates a defect 20 in the workpiece.

[0023] Array 22 of defects 20 is created by translating ...

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PUM

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Abstract

A method for separating and releasing a closed-form piece from a workpiece (12) made of a brittle material is disclosed. A first pulsed laser-beam (14) creates defects along the outline of the closed-form piece (62). A second laser-beam (40) selectively heats the closed-form piece (62) for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam (40) is applied for a second time that causes melting and deformation of the closed-form piece (62). The deformation opens a gap between the closed-form piece (62) and the rest of the workpiece (12), thereby allowing release of the closed-form piece (62).

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Patent Application Serial No. 62 / 703,806, filed July 26, 2018, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present invention generally relates to cutting brittle materials with a beam of laser radiation. In particular the invention relates to the separation and release of closed forms from laser processed brittle materials using a laser radiation beam. Background technique [0004] Laser material processing is increasingly used to cut, drill, mark and scribe a wide variety of materials, including brittle materials such as glass, ceramics, silicon and sapphire. Conventional machining produces undesirable defects, such as microcracks, which may propagate when the machined brittle material is stressed, thereby degrading and weakening the machined brittle material. Laser machining of brittle materials using a focused...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/04C03B33/02C03B33/09C03B33/033B23K26/0622B23K26/53B23K26/70
CPCC03B33/0222C03B33/091C03B33/04B23K26/53B23K26/0624C03B33/033Y02P40/57B23K26/0622B23K26/55B23K26/702B23K2103/52B23K2103/54B23K26/0626B23K26/0869
Inventor S·格罗宁格M·沙迪L·穆勒尔斯J·塞宾
Owner 相干慕尼黑有限公司