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3D printing photosensitive resin and preparation method and application thereof

A photosensitive resin, 3D printing technology, applied in the field of 3D printing and light curing, can solve the problem of brittleness of photosensitive resin, achieve the effect of good toughness, good heat resistance, and expand the application field

Active Publication Date: 2021-05-28
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the defect that the existing 3D printing photosensitive resin is generally brittle, and then provide a 3D printing photosensitive resin and its preparation method and application. The 3D printing photosensitive resin can improve the toughness of 3D printing parts, And maintain its good transparency and thermal stability

Method used

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  • 3D printing photosensitive resin and preparation method and application thereof
  • 3D printing photosensitive resin and preparation method and application thereof
  • 3D printing photosensitive resin and preparation method and application thereof

Examples

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preparation example Construction

[0058] The preparation method of the present invention will be further described in detail in conjunction with specific examples below. It should be understood that the following examples are only for illustrating and explaining the present invention, and should not be construed as limiting the protection scope of the present invention. All technologies realized based on the above contents of the present invention are covered within the scope of protection intended by the present invention.

[0059] The experimental methods used in the following examples are conventional methods unless otherwise specified; the reagents and materials used in the following examples can be obtained from commercial sources unless otherwise specified.

[0060] In the description of the present invention, it should be noted that the test process of tensile strength is completed with reference to ASTM D638. The test process of tensile elongation at break is completed with reference to ASTM D638. Th...

Embodiment 1

[0062] Preparation of silicone core-shell nanoparticles:

[0063] Octamethylcyclotetrasiloxane (30g), methyltriethoxysilane (5g), OP-10 1g, sodium dodecylbenzenesulfonate 1g, distilled water 300g, mixed at a speed of 12000r / min for 10min, The mixed solution was added into a four-necked flask, 0.4 g of KPS was added, and stirred at 80° C. for 2 h to generate polysiloxane nanoparticles with a conversion rate of about 86%.

[0064] Sodium bicarbonate was added to adjust the mixture to neutrality, KPS (0.3 g) was added, and after stirring for 30 min, 31.8 g of methyl methacrylate was added dropwise at a rate of 10 ml / h, and reacted at 80° C. for 2 hours. 3 g of glycidyl methacrylate was added dropwise at a rate of 10 ml / h, and reacted at 80° C. for 1 hour, and nitrogen protection was used throughout the above reaction. Add CaCl 2 The solution was demulsified, filtered and washed with hot distilled water for 3 times, then freeze-dried for 48 hours for later use, and about 42 g of...

Embodiment 2

[0069] The preparation of organosilicon core-shell nanoparticles is the same as in Example 1.

[0070] 40 parts of prepolymer epoxy resin (DER331, Dow Chemical), 10 parts of prepolymer epoxy acrylate (CN104NS, Sartomer), 20 parts of reactive diluent ethoxylated trimethylolpropane triacrylate, Mix 13 parts of reactive diluent 3-ethyl-3-hydroxyoxetane, 6 parts of reactive diluent pentaerythritol triacrylate (SR444NS, Sartomer), heat to 80°C and stir until transparent; add 5 parts of the above The prepared modified silicone core-shell nanoparticles were stirred at a high speed at 25°C for 6h (rotating speed 2500r / min); adding 2 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone, photoinitiator diphenyl-(4 - 4 parts of phenylthio)phenylsulfonium hexafluoroantimonate, heated to 60° C. with a constant temperature magnetic stirring device, and stirred for 1 hour in the dark to prepare a resin for later use.

[0071] Use a 355nm SLA 3D printer for 3D printing.

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Abstract

The invention discloses 3D printing photosensitive resin and a preparation method and application thereof. The photosensitive resin comprises the following raw materials: a prepolymer, a reactive diluent, a photoinitiator and organic silicon core-shell nanoparticles, wherein the organic silicon core-shell nanoparticles comprise core-shell structures composed of polysiloxane and PMMA, and are modified by epoxy groups, the organic silicon core-shell particles have excellent toughening effect, the refractive index is close to that of a cured resin, the transparency of a product is not influenced while toughening is performed, and good heat resistance is maintained.

Description

technical field [0001] The invention relates to the field of 3D printing and photocuring, in particular to a 3D printing photosensitive resin and its preparation method and application. Background technique [0002] 3D printing technology has the advantages of short manufacturing cycle, the ability to process parts with complex structures, and high material utilization, and has broad application prospects. In 3D printing technology, laser light curing technology (SLA) is the most widely used technology, which uses the printing mode of 355nm on-road light, which has a larger printing plane and lower volume shrinkage. However, since the resin materials used in existing 3D printing are usually highly cross-linked IPN network structures, compared with thermoplastic resins such as ABS and PBT, the materials have insufficient toughness, are easy to be brittle and difficult to use, and are especially suitable for industries such as automobiles and home appliances. . At the same t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F285/00C08F222/20B33Y70/00
CPCC08F283/10C08F283/105C08F285/00B33Y70/00
Inventor 翁子骧李悦微吴立新
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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