A method for cladding metal on pcb sidewalls
A metal and cladding technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, printed circuit, printed circuit components, etc.) Effect
Active Publication Date: 2022-07-01
珠海杰赛科技有限公司 +1
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Problems solved by technology
This processing technology can only make all layers of the side wall coated with metal, or all layers are not coated with metal, and it is impossible to selectively cover certain layers on the side wall, and mechanical processing cannot accurately reach the target signal layer.
Method used
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Embodiment 1
[0036] The following takes the PCB with 1-2 layers of metal cladding on the side wall and 3-4 layers not clad with metal as an example to introduce. The signal layer that needs to be covered, the size of the core board and the glue resisting material are determined, and the lamination is carried out, which all belong to the protection scope of the present invention.
[0037] A method for coating metal on PCB sidewalls, the schematic diagram of the preparation process is shown in figure 1 , see the process flow diagram figure 2 , combined with figure 1 and figure 2 , the method includes the following steps:
[0038] (1) Material preparation: Take the core board (core1) whose side wall needs to be covered with metal, the core board (core2) whose side wall does not need to be covered with metal, the prepreg (PP) and silica gel, and the milling material; the side wall does not need to be covered with metal The length of the core board is 5mm larger than the length of the fin...
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Abstract
The invention belongs to the technical field of circuit board fabrication, and discloses a method for cladding metal on a side wall of a PCB. The method includes the following steps: (1) a core board, a prepreg, a glue-resisting material, and a milling material; (2) the prepreg is placed between the core boards, and the prepreg is placed on a side of the core board whose side walls do not need to be covered with metal. side, the resist material is placed on the other side of the core board where the side wall does not need to be covered with metal; press-fit, remove the resist material, a preliminary board with a groove bottom is obtained; (3) the preliminary board is subjected to chemical copper deposition, the The surface, side walls and tank bottom of the initial plate are plated with copper, tinned, and a tin-plated plate is obtained; (4) The tin layer and copper layer on the tank bottom and the back of the tank bottom of the tin-plated plate are etched in turn, and then the surface and the tank are removed. The tin of the side wall is cut again to get the PCB. The method can realize selective coating of metal on the side wall of the PCB, the connection reliability is high, and the starting signal layer of the coating metal is accurately and without deviation from the target signal layer.
Description
technical field [0001] The invention belongs to the technical field of circuit board fabrication, and in particular relates to a method for metallizing a side wall of a PCB. Background technique [0002] With the accelerated transformation of the high-end PCB (printed circuit board) market to high-frequency and high-speed, the requirements for the shielding effect of high-frequency and high-speed signal layers are also getting higher and higher. Coating metal on the side wall of the printed board is an effective way to enhance the shielding effect. However, some designs integrate the high-frequency and low-frequency signal layers on the same circuit board. The high-frequency part needs to coat the metal on the side wall of the printed board, while the low-frequency part does not need to coat the metal on the side wall. New technical requirements are put forward for the metallized cladding of the side walls of the printed board. [0003] In the related art, when the side wa...
Claims
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IPC IPC(8): H05K3/10H05K3/18H05K1/02
CPCH05K3/107H05K3/184H05K1/0216
Inventor 邓勇刘国汉李静周德良关志锋
Owner 珠海杰赛科技有限公司