3D printing soft elastic photosensitive resin composition and preparation method thereof

A photosensitive resin and 3D printing technology, which is applied in the field of 3D printing materials, can solve the problems that the mechanical properties cannot meet the market demand, and achieve the effects of good tactile effect, good compatibility and high printing success rate of samples

Active Publication Date: 2021-06-01
WANHUA CHEM GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its mechanical properties cannot meet the increasing market demand

Method used

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  • 3D printing soft elastic photosensitive resin composition and preparation method thereof
  • 3D printing soft elastic photosensitive resin composition and preparation method thereof
  • 3D printing soft elastic photosensitive resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] Polyamide-modified urethane acrylate resin I-1 was prepared.

[0081] 500ml of DMF was added to the reaction flask equipped with a stirring device, a temperature control device and a condensing device, then 200g of amino polyether (D2000) and 4.5g of oxalic acid were added, an inert protective gas was introduced, and the reaction was carried out at 200°C for 8 hours. After the acid value was 0, the temperature was lowered to 70°C, 22.23g IPDI was added to react for 1h, the temperature was controlled to 60°C and 18.5g tert-butylaminoethyl methacrylate was added to react for 1h, and the prepolymerization was measured by n-butylamine titration method. The NCO content of the substance was 0.03%, the reaction was stopped, the material was transferred to a rotary evaporator, and the DMF solvent was evaporated to obtain the polyamide-modified polyurethane acrylate resin I-1.

Embodiment 2

[0083] Polyamide-modified urethane acrylate resin I-2 was prepared.

[0084] 500ml of DMF was added to the reaction flask equipped with a stirring device, a temperature control device and a condensing device, then 300g of aminopolyether (D2000) and 4.5g of oxalic acid were added, an inert protective gas was introduced, and the reaction was conducted at 240°C for 4 hours. After the acid value was 0, the temperature was lowered to 100°C, 44.46g IPDI was added to react for 3h, the temperature was controlled to 70°C and 37g tert-butylaminoethyl methacrylate was added to react for 1h, and the prepolymer was measured by n-butylamine titration method. The NCO content was 0.019%, the reaction was stopped, the material was transferred to a rotary evaporator, and the DMF solvent was evaporated to obtain a polyamide-modified polyurethane acrylate resin I-2.

Embodiment 3

[0086] Preparation of polyamide-modified urethane acrylate resin I-3.

[0087] 500ml of DMF was added to the reaction flask equipped with a stirring device, a temperature control device and a condensing device, then 150g of amino polyether (D2000) and 4.5g of oxalic acid were added, an inert protective gas was introduced, and the reaction was carried out at 220°C for 6 hours. After the acid value was 0, the temperature was lowered to 70°C, 11.12g IPDI was added to react for 2h, the temperature was controlled to 80°C, and 9.25g tert-butylaminoethyl methacrylate was added to react for 1h, and the prepolymerization was measured by n-butylamine titration method. The NCO content of the substance was 0.015%, the reaction was stopped, the material was transferred to a rotary evaporator, and the DMF solvent was evaporated to obtain the polyamide-modified polyurethane acrylate resin I-3.

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Abstract

The invention provides a 3D printing soft elastic photosensitive resin composition and a preparation method thereof. The composition contains polyamide modified polyurethane acrylate resin, a photocuring diluting monomer with a (methyl) acrylate functional group, a photoinitiator and an auxiliary agent. The polyamide modified polyurethane acrylate resin is obtained by reaction of polyisocyanate, an active hydrogen polymer, polybasic acid and an amino acrylate compound. The soft elastic photosensitive resin is high in tensile strength, large in elongation at break, low in shrinkage rate, small in viscosity and easy to print, and can meet the performance requirements of soft and elastic wearing markets such as bracelets and shoe materials.

Description

technical field [0001] The invention relates to the field of 3D printing materials, in particular to a 3D printing soft elastic photosensitive resin composition and a preparation method thereof. Background technique [0002] 3D printing technology, also known as additive manufacturing technology or rapid prototyping technology, is a technology that uses a computer to convert a three-dimensional model into a simple two-dimensional plane model, and then controls the forming process to convert materials into complex molded parts. This method solves the defects of the traditional processing methods such as difficult forming, long cycle, waste of resources and low efficiency. Among them, the photocuring molding process is a kind of 3D printing technology. It uses liquid photosensitive resin as raw material. Under computer control, the light source irradiates the resin to solidify it and solidifies it layer by layer. This technology has the advantages of simple operation and fast ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/00C08F220/28C08F2/48B33Y70/10C08G18/67C08G18/60
CPCC08F283/008C08F2/48C08G18/678C08G18/603B33Y70/00
Inventor 臧圣彪程继业曹玉阳晋云全纪学顺
Owner WANHUA CHEM GRP CO LTD
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