Multi-station probe card and wafer testing method

Abstract

The invention provides a multi-station probe card and a wafer testing method. The multi-station probe card comprises: a base plate provided with a plurality of through holes; a reinforcing plate located on the upper surface of the base plate and provided with a heat conducting sheet, wherein the heat conducting sheet is used for conducting external temperature to the base plate; and a plurality of probes circumferentially distributed outside each through hole, wherein one end of each probe is connected with the lower surface of the base plate, the other end of each probe extends outwards from the lower surface of the base plate, and the through holes and the circumferentially distributed probes form a probe station. According to the invention, the test accuracy and the test yield of the wafer can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a multi-station probe card and a wafer testing method. Background technique [0002] Wafer testing is an important link in the entire process of integrated circuits. It is an electrical parameter measurement and performance test performed before wafer dicing in order to verify the consistency of integrated circuit design specifications. Wafer testing develops a test plan based on product parameters and performance tests. In the process of formulating a test plan, the processing of test hardware is the most important, mainly including several aspects: test machine, test probe card and test hardware. The tester and the probe station are usually general-purpose machines, and the probe card serves as the core interface between the tester and the device under test on the wafer, which can best reflect the test plan of a product. A typical probe card is usually a printed circuit...

AI Technical Summary

Problems solved by technology

However, the main problem of this method is that the number of times of preheating is too long and the time is too long, which makes the whole wafer test time too long and the test efficiency is low; Problems may occur at any time due to contact conditions, stitches, etc., resulting in low test yield

But preheating takes time and monitoring of stitches, the efficiency is low and the effect is not ideal

In addition, due to the wafer production process, the surface of the edge area of ​​the wafer is relatively rough. When the probe card is in contact with the pad or bump in the edge area of ​​the wafer, the probes on the probe card are easily worn. And the price of the probe card is relatively expensive. If the probes on the probe card are worn out, it will cause inaccurate tests at other positions and reduce the service life of the probe card.

Images