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Conductive, shielding and heat dissipation composite material

A composite material and conductive adhesive film technology, which is applied in the direction of circuit heating devices, circuit devices, printed circuit components, etc., can solve the problems of device softening, slow heat dissipation effect, and unsatisfactory conductive effect, so as to achieve good application prospects and improve production Efficiency, good heat dissipation and the effect of shielding signals

Inactive Publication Date: 2021-06-01
深圳市鑫诺诚科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention overcomes the existing conductive, shielding, and heat-dissipating composite materials. During its use, the heat dissipation effect is slow, which easily causes the device to soften, does not have a good shielding signal function, and the conductive effect is not ideal. question

Method used

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  • Conductive, shielding and heat dissipation composite material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, a conductive, shielding, and heat-dissipating composite material includes a first ultra-thin electrolytic copper foil 1, a first conductive adhesive film 2, artificial graphite 3, a second conductive adhesive film 4 and a second ultra-thin electrolytic copper foil 5 , the first ultra-thin electrolytic copper foil 1 is fixedly bonded to the bottom end of the first conductive adhesive film 2, and the bottom end of the first conductive adhesive film 2 is fixedly bonded to the bottom end of the artificial graphite 3, and the bottom end of the artificial graphite 3 is connected to the bottom end of the second conductive adhesive film 4 The end is fixedly bonded, and the second conductive adhesive film 4 is fixedly bonded to the bottom end of the second ultra-thin electrolytic copper foil 5;

[0024] At least make the copper foil after the plasma surface treatment as the cathode, the anode and the electrolyte to jointly construct an electrochemical ...

Embodiment 2

[0026] The polyimide composite film of artificial graphite 3 is placed under vacuum conditions and heated to 400-700°C, and kept warm for more than three times, with each holding time ≥ 1h, and then continued to heat up to no higher than 2000°C to complete the carbonization treatment and obtain carbonization After the polyimide film is obtained, the carbonized polyimide film is heated to above 2800° C. under the protection of nitrogen for graphitization treatment to obtain an artificial graphite film.

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Abstract

The invention relates to a conductive, shielding and heat dissipation composite material which comprises a first ultra-thin electrolytic copper foil, a first conductive adhesive film, artificial graphite, a second conductive adhesive film and a second ultra-thin electrolytic copper foil. The first ultra-thin electrolytic copper foil is fixedly bonded with the bottom end of the first conductive adhesive film, the first conductive adhesive film is fixedly bonded with the bottom end of the artificial graphite, and the artificial graphite is fixedly bonded with the bottom end of the second conductive adhesive film. According to the invention, a composite structure is an upper ultra-thin electrolytic copper foil layer and an lower ultra-thin electrolytic copper foil layer which are 100% bonded through the conductive adhesive film, the middle layer is locally coated with the artificial graphite, the bottom is coated with the conductive adhesive film, and the middle layer is locally coated with the graphite so that the original excellent conductive performance of the copper foil is maintained, and meanwhile better heat dissipation and signal shielding functions are achieved; and an influence of a traditional composite material on a conductive speed of the copper foil is changed, and compared with a traditional Hummers method, by using the material of the invention, the step of preparing a graphene oxide precursor solution omits a drying step, is more convenient, the production efficiency is improved, and the material has a very good application prospect in the field of electro-catalysis.

Description

technical field [0001] The invention relates to a conductive, shielding and heat-dissipating composite material, which belongs to the technical field of electrolytic copper foil. Background technique [0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL), printed circuit boards (PCB), and lithium-ion batteries. In today's rapid development of the electronic information industry, electrolytic copper foil is known as the signal and power transmission and communication of electronic products. As the substrate material of PCB, my country has become the third largest producer of copper clad laminate in the world, which has also made my country's electrolytic copper foil industry develop by leaps and bounds in recent years. The main process of electrolytic copper foil production There are solutions for foiling, surface treatment and product slitting. [0003] The existing conductive, shielding, and heat-dissipating composite ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0213H05K1/0216H05K1/0201
Inventor 杨茂洲钟卫殷承秋
Owner 深圳市鑫诺诚科技有限公司