Efficient diamond wire saw for cutting brittle material, and application thereof

Abstract

The invention relates to the technical field of wire cutting, in particular to an efficient diamond wire saw for cutting a brittle material, and application thereof. A core of the wire saw stated in the invention is a metal wire, and the surface of the fretsaw is diamond particles consolidated by a metal coating; the wire saw is composed of a bending part, and the orthographic projection of the bending part is a periodic waveform curve; a periodic wave in the waveform curve comprises one or more wave crests or wave troughs, and the wavelength of the periodic wave is L; the height between the highest wave crest and the lowest wave trough is the wave height H, and the diameter of the core of the wire saw is the wire diameter D, and the axial length of the waveform curve of the orthographic projection of the wire saw is S; the length of the wire saw body is S', and the relation between the wavelength L and the wire diameter D and the relation between the wave height H and the wire diameter D are limited; and the structural elongation when the applied tension is 0.3-0.9 time the breaking force of the wire saw body is limited. By means of the wire saw provided by the invention, the surface quality of a cut product can be greatly improved, the cutting time is shortened, and the cutting efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of wire cutting, in particular to an efficient diamond wire saw for cutting brittle materials and its application. Background technique [0002] In the photovoltaic, semiconductor, LED and other industries, the use of multi-wire cutting technology to cut hard and brittle materials such as silicon ingots, sapphire and other materials into pieces is currently the most commonly used and most efficient process. The general process is as follows: [0003] 1) Build a set of two or three guide wheels; [0004] 2) Coating polymer material on the guide, and opening microgrooves on it; [0005] 3) Wrap a single diamond wire saw on the micro-groove of the guide wheel, and wind it from one side of the guide wheel to the other side, and finally form a wire mesh; [0006] 4) The materials to be cut, such as silicon ingots and sapphires, are fixed above the wire mesh, and fall slowly at a certain speed, gradually contac...

AI Technical Summary

Problems solved by technology

The friction and extrusion between diamond particles and the material to be cut will generate a lot of heat. If the heat cannot be conducted well, the high temperature generated by friction and extrusion will make the metal coating on the wire saw soft and the diamond particles will fall off. , so that it is impossible to cut

At the same time, the broken and peeled debris should be brought out from the cutting seam in time, otherwise, a large amount of debris will wrap the diamond particles on the wire saw, making it lose its cutting ability

[0009] Ordinary linear diamond wire saws can only rely on the adsorption of the straight surface to carry the coolant into the seam and bring the silicon powder out of the seam. Such carrying capacity is insufficient, resulting in frequent cutting during the cutting process. There will be various quality defects, such as line marks and other problems, which also make it difficult to continue to shorten the unit cutting time and improve cutting efficiency

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