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Encapsulation structure and preparation method thereof

A technology of packaging structure and surface fabrication, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of low product yield, high cost, complex process, etc. The effect of enhanced structural strength and flexible preparation process

Active Publication Date: 2022-04-15
池州昀冢电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, ceramic dams are generally sintered by LTCC (Low Temperature co-fired ceramics, low temperature co-fired ceramics) technology, so that the resolution of ceramic dam lines is not high, and the cost of forming through high-temperature sintering is high
There are generally three ways to make metal dams. The first method is that the metal dam is formed by stamping a single metal or alloy, and then the metal dam is bonded to the ceramic substrate. In this method, the metal dam and the ceramic substrate There is an organic connection between them, and the airtightness is not good; the second way is to weld the metal dam on the ceramic substrate through the metal kovar ring, which requires high welding technology, resulting in low product yield and high cost; the third way The first way is to make the dam on the ceramic substrate by electroplating. The width of the dam in this way is limited and the process is more complicated.
Plastic dams (including epoxy resin) are poorly resistant to UV (ultraviolet) radiation and cannot be welded on cover plates

Method used

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  • Encapsulation structure and preparation method thereof
  • Encapsulation structure and preparation method thereof
  • Encapsulation structure and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0042] refer to Figure 1 to Figure 5 , Embodiment 1 of the present application provides a package structure, the package structure includes: a substrate 10 , a dam 20 , a metal part 30 , and may also include an electronic component 40 and a cover 50 .

[0043]The substrate 10 is preferably a ceramic substrate, and the ceramic substrate has good properties such as high temperature resistance, corrosion resistance, high thermal conductivity, high mechanical strength, and matching thermal expansion coefficient with the chip material. The substrate 10 has an opposite first surface and a second surface. The first surface is, for example, an upper surface of the substrate 10 , and the second surface is, for example, a lower surface of the substrate 10 .

[0044] In some embodiments of the present application, the substrate 10 is provided with a conductor 11 penetrating the substrate 10 and connecting the first surface and the second surface. The substrate 10 may have a via hole 12 ...

Embodiment 2

[0059] refer to Figure 1 to Figure 7 , Embodiment 2 of the present application provides a package structure, and the package structure is obtained by the following preparation method. The preparation method includes steps S101 to S103 , and may also include steps S104 to S106 .

[0060] Step S101 : providing a substrate 10 having opposite first and second surfaces.

[0061] The substrate 10 in this embodiment may be the same as the substrate 10 in Embodiment 1, and details are not described herein.

[0062] Step S102 : disposing an enclosure dam 20 on the first surface of the substrate 10 , the enclosure dam 20 includes an inner dam body 21 and an outer dam body 22 , the inner dam body 21 is sleeved in the outer dam body 22 , and the inner dam body 21 Made of plastic material, the inner dam body 21 has a top surface, opposite inner and outer surfaces.

[0063] The dam 20 in this embodiment can be the same as the dam 20 in Embodiment 1, the inner dam body 21 in this embodime...

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Abstract

The application discloses a packaging structure and a preparation method thereof. The preparation method includes: providing a substrate, the substrate has an opposite first surface and a second surface; setting a dam on the first surface of the substrate, and the dam includes an inner dam body and an outer layer dam body, The inner dam body is sheathed in the outer dam body, the inner dam body is made of plastic material, the inner dam body has a top surface, an opposite inner side surface and an outer side surface; a metal part is provided, the The metal piece is arranged on the inner dam body and covers at least part of the top surface and / or at least part of the inner side surface of the inner layer dam body. The packaging structure obtained by the above preparation method can flexibly set the position of the metal parts according to the packaging needs, overcome the defects existing in the existing dams, and meet the packaging needs.

Description

technical field [0001] The present application relates to the technical field of packaging, and in particular, to a packaging structure and a preparation method thereof. Background technique [0002] Sensors, crystal oscillators, resonators, lasers, camera devices, LED modules and other devices are generally packaged with ceramic substrates. The commonly used packaging structure is to set a dam on a ceramic substrate with a circuit layer, and set a cover plate on the dam. , the cover plate, the dam and the ceramic substrate are surrounded by a sealed chamber. The sealed chamber is used to place various types of chips and other devices. By filling the sealed chamber with packaging glue, inert gas or direct vacuuming, the device can be sealed. Pack. [0003] At present, there are roughly three types of dams: 1. Ceramic dams, 2. Metal dams, and 3. Plastic dams. Among them, the ceramic dam is generally formed by sintering with LTCC (Low Temperature co-fired ceramics, low tempe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/52H01L23/06H01L23/08H01L23/04H01L23/055H01L23/10
CPCH01L21/50H01L21/52H01L23/06H01L23/08H01L23/04H01L23/055H01L23/10
Inventor 章军
Owner 池州昀冢电子科技有限公司