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Production process of liquid crystal PCB

A technology of PCB circuit board and production process, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., to achieve the effect of reducing production cost

Pending Publication Date: 2021-07-02
江苏协和电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as one of the key components of the liquid crystal phased array antenna, the liquid crystal PCB board is still in the initial stage of research and development. How to use the existing PCB board production line to mix and integrate the liquid crystal PCB board to reduce the production cost is a problem that needs to be discussed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Embodiment 1: a kind of liquid crystal PCB circuit board production process, comprises the following steps:

[0016] PTFE material is used as the PCB substrate, and the inner layer dry film treatment is carried out to transfer the circuit pattern to the PCB substrate; the inner layer dry film is the process of transferring the inner layer circuit pattern to the PCB board, and the inner layer dry film includes grinding board Handling, lamination, exposure, development, etching and stripping processes. The main function of the grinding plate: the basic pretreatment is mainly to solve the problems of the surface cleanliness and surface roughness of the PCB substrate. Remove oxidation, increase the roughness of the copper surface, and facilitate the film to adhere to the copper surface. The inner film is to paste a special photosensitive film on the surface of the copper plate. This film will cure when exposed to light, forming a protective film on the board. Exposure an...

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Abstract

The invention relates to a liquid crystal PCB production process, which comprises the following steps of: adopting a PTFE material as a PCB substrate, implementing inner layer dry film treatment, and transferring a circuit pattern onto the PCB substrate; dipping the PCB base material in a browning solution to carry out browning treatment on the base material; laminating and bonding a first transparent substrate, a first transparent electrode, a liquid crystal layer, a second transparent electrode and a second transparent substrate are sequentially on the PCB base material by virtue of PP sheets, wherein the liquid crystal layer is formed by polymerizing a liquid crystal mixture; drilling holes among the layers by using a drill bit to form communicating holes among the layers; dipping the liquid crystal PCB in a copper deposition cylinder for copper deposition plate plating; performing outer layer dry film treatment on the liquid crystal PCB after the copper deposition plate plating; and then carrying out resistance welding, character screen printing, surface treatment, cutting forming, electrical testing and packaging. According to the invention, the liquid crystal PCB is produced by using the existing PCB production line, so that the cost is reduced.

Description

technical field [0001] The invention relates to the field of PCB production. Background technique [0002] At present, the international development of liquid crystal phased array antenna products and technologies is mainly concentrated in Europe and America. Among them, for the research and development of materials, Germany's Merck Group (MERCK) has almost formed a monopoly position; for the development of liquid crystal phased array antenna products, there are mainly Kymeta companies that provide satellite services for the United States and dedicated to modular antenna design. German Alcan Systems company. However, China is still in its infancy in terms of materials and device research and development. [0003] As the civilian communication band shifts to high-frequency bands, the application of liquid crystal phased array antennas will expand, and will gradually be introduced from satellite radar to communication base stations, small base stations and mobile terminals, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24
CPCH05K3/241H05K2203/0703
Inventor 曹良良
Owner 江苏协和电子股份有限公司