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High-dielectric high-mechanical-strength glass ceramic sintered substrate and preparation method thereof

A technology for sintering substrates and glass ceramics, which is used in circuit substrate materials, electrical components, printed circuits, etc.

Pending Publication Date: 2021-07-06
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] None of the existing ceramic substrates or glass substrates can take into account the problems listed above

Method used

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  • High-dielectric high-mechanical-strength glass ceramic sintered substrate and preparation method thereof
  • High-dielectric high-mechanical-strength glass ceramic sintered substrate and preparation method thereof
  • High-dielectric high-mechanical-strength glass ceramic sintered substrate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0052] SiO 2 -Al 2 o 3 -MgO-ZnO-B 2 o 3 Crystalline glass A (SiO 2 : 44% by weight, Al 2 o 3 : 29% by weight, MgO: 11% by weight, ZnO: 7% by weight, B 2 o 3 : 9% by weight), crystalline glass B (SiO 2 : 50% by weight, Al 2 o 3 : 20% by weight, MgO: 7% by weight, ZnO: 3% by weight, B 2 o 3 : 9% by weight), and ZrO with an average particle size of 1 μm or less 2 and CaCO 3 And SrTiO with an average particle size of 1 μm or less 3 Mix according to the composition in Table 1, and CaZrO with an average particle size of 0.7 μm is added to samples No.1 to 17 in Table 1. 3 .

[0053] Add organic adhesives, plasticizers, and toluene to the mixture, and make green ceramic tapes with a thickness of 300 μm by doctor blade method, and then laminate the green ceramic tapes in 5 pieces at 50 ° C and apply 100 kg / mm 2 Pressurized conditions for autoclaving. Then, the obtained laminate was subjected to debonding treatment at 700°C in an atmosphere containing water vapor / nitro...

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Abstract

The invention discloses a high-dielectric high-mechanical-strength glass ceramic sintered substrate and a preparation method thereof. The high-dielectric high-mechanical-strength glass ceramic sintered substrate comprises Al, Si, Mg, Zn and B oxides, Zr and Ca oxides, and Sr and Ti oxides. Sintering is carried out at 800-1000 DEG C, and gold, silver and copper conductor wiring is compatible. Glass is combined with zirconium oxide, a calcium compound and SrTiO3, a composite oxide crystal phase composed of a ZrO2 phase, a perovskite phase, Sr and Al is separated out, and the dielectric constant is increased. When the substrate is manufactured, the mechanical strength of the material is improved by the separated spinel crystal phase, and the absolute value of TCC can be reduced by the separated perovskite. The multi-layer co-firing of Au, Ag, Cu and other wiring can be realized, and the glass ceramic sintered substrate has the advantages of high dielectric constant, high mechanical strength, low TCC and the like, and can be widely applied to integrated and miniaturized assembly carriers of microwave circuits as a substrate for microwave circuit assembly.

Description

technical field [0001] The present invention relates to the field of microwave electronics, specifically, to a glass-ceramic substrate material and a preparation method thereof, and further to a high-dielectric and high-strength glass-ceramic substrate material and a preparation method thereof. Background technique [0002] With the advent of high informatization and microwave communication era, wireless communication has a trend of continuous development towards high frequency and high speed. The research on the compact circuit structure of satellite broadcasting and satellite communication is developing rapidly, and higher and more urgent requirements are put forward for the integration and miniaturization of microwave circuits such as T / R components, filters, and resonators. [0003] The size of microwave components and circuits is based on the wavelength of the electromagnetic wave used. Assuming that the specific permittivity εr, the wavelength λ of electromagnetic wave...

Claims

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Application Information

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IPC IPC(8): C04B35/488C04B35/49C04B35/622C04B35/626C03C14/00C03C10/06C03C10/02H05K1/03
CPCC04B35/4885C04B35/49C04B35/622C04B35/62605C03C14/006C03C10/0045H05K1/0306C04B2235/365C04B2235/3208C04B2235/3236C04B2235/3213C04B2235/5436
Inventor 方亮罗玉国韩玉成杨俊胡磊方开美
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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