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A kind of preparation method of surface protective layer of chip type ceramic PTC thermistor

A thermistor and protective layer technology, which is applied in the field of preparation of the surface protective layer of chip ceramic PTC thermistors, can solve the problems of poor corrosion resistance of electroplating solution and poor matching.

Active Publication Date: 2016-10-05
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose a method for preparing a surface protective layer of a chip ceramic PTC thermistor, and form a protective layer on the surface of a chip ceramic PTC thermistor by co-firing to solve the problem of the existing PTC surface protective layer. Technical problems of poor matching with PTC ceramic body and resistance to electroplating solution corrosion

Method used

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  • A kind of preparation method of surface protective layer of chip type ceramic PTC thermistor
  • A kind of preparation method of surface protective layer of chip type ceramic PTC thermistor
  • A kind of preparation method of surface protective layer of chip type ceramic PTC thermistor

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Embodiment 1

[0026] The present embodiment provides a kind of concrete process of preparing chip type ceramic PTC thermistor surface protection layer according to above-mentioned method:

[0027] 1) According to the number of parts by mass: take 100 parts of inorganic powder; 90 parts of organic solvent, wherein 90 parts of organic solvent includes 10 parts of ethanol, 60 parts of isobutanol, 20 parts of terpineol; and trioleic acid as a dispersant 0.8 part of glyceride. 100 parts of the inorganic powder include 82.5 parts of barium titanate, 5.5 parts of silicon dioxide, 5 parts of aluminum oxide, 3 parts of calcium oxide, 2.5 parts of lithium carbonate, and 1.5 parts of bismuth trioxide. The inorganic powder, the organic solvent and the dispersant are mixed and ball-milled for about 6 hours to obtain the precursor of the slurry used for preparing the protective layer of the sheet-type ceramic PTC thermistor.

[0028] 2) Add 8 parts of polymethyl methacrylate as a binder to the precursor...

Embodiment 2

[0032] 1) According to the number of parts by mass: take 100 parts of inorganic powder; 60 parts of organic solvent, wherein 60 parts of organic solvent includes 5 parts of ethanol, 45 parts of isopropanol, 10 parts of ethylene glycol; and 0.6 parts of oleic acid as a dispersant share. 100 parts of the inorganic powder include 75 parts of barium titanate, 8 parts of silicon dioxide, 8 parts of aluminum oxide, 4 parts of calcium oxide, 4 parts of lithium carbonate, and 1 part of bismuth trioxide. The inorganic powder, the organic solvent and the dispersant are mixed and ball-milled for about 5 hours to obtain the precursor of the slurry used for preparing the protective layer of the chip ceramic PTC thermistor.

[0033] 2) Add 6 parts of ethyl cellulose as a binder to the precursor obtained in the above 1), mix and ball mill again for about 8.5 hours to obtain a slurry for preparing a protective layer of a chip ceramic PTC thermistor.

[0034] 3) Use a coating machine to evenl...

Embodiment 3

[0037] 1) According to the number of parts by mass: take 100 parts of inorganic powder, 80 parts of organic solvent, wherein 80 parts of organic solvent includes 8 parts of ethyl acetate, 60 g of isobutanol, 12 g of n-propanol; and 0.8 part of fish oil as a dispersant . 100 parts of the inorganic powder include 85 parts of barium titanate, 4 parts of silicon dioxide, 4 parts of aluminum oxide, 3 parts of calcium oxide, 3 parts of lithium carbonate, and 1 part of bismuth trioxide. The inorganic powder, the organic solvent and the dispersant were mixed and ball-milled for 6.5 hours to obtain a slurry precursor for preparing a protective layer of a chip ceramic PTC thermistor.

[0038] 2) Add 8 parts of polyvinyl butyral as a binder to the precursor prepared in the above 1), and mix and ball mill again for 8 hours to obtain a slurry for preparing a protective layer of a chip ceramic PTC thermistor.

[0039] 3) Use a coating machine to evenly coat the protective layer slurry prep...

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Abstract

The invention discloses a method for preparing a chip ceramic PTC thermistor surface protection layer. The method comprises the following steps: S1. mixing and ball-milling inorganic powder, an organic solvent and a dispersing agent according to a proportion of 100: (60-100): (0.6-1) to obtain a slurry precursor used for preparing the surface protection layer, wherein the inorganic powder comprises 70.0-90.0% of barium titanate, 2.0-10.0% of silicon dioxide, 2.0-10.0% of aluminum oxide, 2.0-5.0% of calcium oxide, 0.5-5.0% of lithium carbonate and 0.5-2.0% of bismuth trioxide; S2. adding an adhesive into the slurry precursor for mixing and ball-milling to obtain protection layer slurry, wherein the mass ratio of the adhesive to the inorganic powder is (6-10):100; S3. coating the protection layer slurry on the surface of a chip ceramic PTC thermistor blank, and sintering the chip ceramic PTC thermistor blank coated with the protection layer slurry at 1150-1250 DEG C to obtain the surface protection layer which is dense, high in insulation resistance and resistant to acid and alkali and is suitable for subsequent plating treatment of chip ceramic PTC.

Description

technical field [0001] The invention relates to the technical field of preparation of ceramic electronic components, in particular to a method for preparing a surface protection layer of a chip-type ceramic PTC thermistor. Background technique [0002] Today, with the rapid development of electronic technology, the whole machine is developing in the direction of lightness, thinness, small size and high reliability. mainstream. High-precision, high-reliability chip PTC has become the focus of research at home and abroad. At present, in order to ensure the soldering performance of chip electronic components, the following two methods are used: 1. Nickel plating and tin plating are performed on the terminal electrodes after the terminal electrodes are formed. However, PTC is a semiconductor material with low surface resistance. At the same time of nickel plating and tin plating, nickel and tin will also adhere to the surface of the PTC ceramic body, causing an electrical shor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/468C04B35/622
Inventor 毛海波贾广平冯志刚杜士雄肖小朋王波
Owner SHENZHEN SUNLORD ELECTRONICS
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