Immersed liquid cooling system

An immersion and water cooling system technology, applied in the field of server heat dissipation, can solve the problems of difficult air cooling, direct contact liquid cooling economic benefits and unsatisfactory heat dissipation performance, and high heating power of motherboard chips

Active Publication Date: 2021-07-06
SHANDONG YINGXIN COMP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention mainly solves the problem that the direct contact liquid cooling has unsatisfactory economic benefits and heat dissipation performance during the heat dissipation process of the server, and the main board chip has high heating power and is difficult to solve by air cooling

Method used

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Effect test

Embodiment 1

[0048] The present invention provides an immersion liquid cooling system, please refer to Figure 1 to Figure 3 ,include:

[0049] Liquid-cooled server cabinets, liquid-cooled servers, auxiliary cooling systems and water-cooling systems.

[0050] The liquid-cooled server cabinet is equipped with a liquid-cooled server, an auxiliary cooling system and a water-cooling system.

[0051] The front end of the liquid-cooled server cabinet is provided with a first fan 1 and a first cooling air duct 2, and the rear end of the liquid-cooled server cabinet is provided with a second fan 3, a second cooling air duct 4, a dry cooler 5, a water collector 6, Cooling water pump 7, cooling system pipeline 8, hard disk 9, main board 10, server power supply 11, plate cover flow channel inlet 12, plate cover flow channel outlet 13, liquid cooling box replenishment port 14, liquid cooling box pressure regulator 15, board Cover flow channel 16, liquid cooling heat dissipation plate 17, high power ...

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Abstract

The invention discloses an immersed liquid cooling system. The system comprises a liquid cooling server cabinet, a liquid cooling server, an auxiliary cooling system and a water cooling system, wherein the liquid cooling server comprises a hard disk module and a mainboard module; the auxiliary cooling system is used for performing air cooling operation on the hard disk module; the water cooling system is used for executing radiation heat exchange operation on the mainboard module; the mainboard module comprises an immersion liquid cooling box device and a liquid cooling plate cover device; the liquid cooling plate cover device is connected with the water cooling system; the immersion liquid cooling box device is used for immersing the mainboard; and the liquid cooling plate cover device is used to perform phase change heat transfer operation on the main board. by means of the mode, the liquid cooling plate cover device can achieve that the immersed liquid cooling arrangement mode is more flexible, the liquid cooling server cabinet is the same as a traditional cabinet in arrangement mode, maintenance and operation are convenient, the more space is saved, a helium hard disk or a solid state disk does not need to be replaced, and the cost of the whole machine is better.

Description

technical field [0001] The invention relates to the technical field of server heat dissipation, in particular to an immersion liquid cooling system. Background technique [0002] The current direct contact liquid cooling uses a huge box for server heat exchange, resulting in slow liquid flow on the server surface, small convective heat transfer coefficient, and limited heat transfer capacity, and the huge box makes the cooling liquid volatile, and adopts The hard disk of the server directly in contact with the liquid cooling method needs to be replaced with a helium hard disk or a solid-state hard disk, which increases the overall cost of the server, and the hard disk is a large-scale component with low power consumption. Because it is immersed in the cooling liquid, it consumes a lot of energy when replacing the hard disk. More coolant, resulting in less economy and less maintenance. Contents of the invention [0003] The invention mainly solves the problem that the dire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/183G06F2200/201Y02D10/00
Inventor 李金波冯云奇王大伟
Owner SHANDONG YINGXIN COMP TECH CO LTD
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