Novel slide glass type internal matching power amplifier

Abstract

The invention relates to a microwave integrated circuit chipset technology based on metal carrier plate integration; wherein a plurality of chips, a matching circuit and a biasing circuit are integrated on a metal carrier plate in a high-density manner, and the components are interconnected through gold wires, so that a chipset product with independent functions is realized. According to the invention, the packaging material and the packaging process of the integrated circuit are saved, the raw material is reduced, the size and the weight are greatly reduced, and the cost is reduced. In addition, the carrier plate is welded on the component substrate through the welding flux, so that the problem of temperature rise of the device caused by the increase of the power density of the power amplifier along with the development of the technology is greatly relieved.

Description

technical field [0001] The invention is a novel chip-mounted internal matching power amplifier, which belongs to the technical field of power amplification. Background technique [0002] With the development of the third-generation semiconductor GaN device technology, more and more GaN microwave devices have been developed, and engineering applications have begun. However, traditional power devices need to be packaged in a package to be used, and the packaged package is generally relatively large in volume and weight. For modern electronic equipment and communication systems and platforms with relatively high weight requirements, the power of this package package Amplifiers are more limited. [0003] Because power amplifiers are mainly used in phased array radar transmitters, a radar integrates tens of thousands of power amplifiers, and in the airborne and shipboard fields, the weight of power amplifiers is strictly required, and a 2048-channel array Take the phased array ...

AI Technical Summary

Problems solved by technology

However, traditional power devices need to be packaged in a package to be used, and the packaged package is generally relatively large in volume and weight. For modern electronic equipment and communication systems and platforms with relatively high weight requirements, the power of this package package Amplifiers are more limited

[0003] Because power amplifiers are mainly used in phased array radar transmitters, a radar integrates tens of thousands of power amplifiers, and in the airborne and shipboard fields, the weight of power amplifiers is strictly required, and a 2048-channel array Take the phased array array as an example, the assembled power amplifiers are as many as 2048 pieces. For airborne, shipborne and other application platforms with strict weight requirements, more than 2,000 power amplifiers packaged in tubes and shells mean huge volume and mass. , while larger mass means higher energy consumption, and larger volume means more inconvenient transportation and mobility

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