Bubble observation and elimination device and method for laser underwater machining

Abstract

The invention discloses a bubble observation and elimination device and method for laser underwater machining, and belongs to the technical field of laser underwater machining in non-traditional machining. The bubble observation and elimination device comprises an ultra-short pulse laser underwater machining unit, a three-way observation unit, a liquid flow circulation unit, a jet flow auxiliary unit, a dry air blowing unit, an ultrasonic vibration unit and a multi-energy-field control unit, wherein the multi-energy-field control unit processes bubble images and adjusts parameters of the liquid flow circulation unit, the jet flow auxiliary unit, the dry air blowing unit and the ultrasonic vibration unit so as to achieve the optimal state of bubble elimination and adapt to ultrafast laser underwater micromachining of various materials under different laser machining parameters. According to the device and the method, laser underwater machining bubbles are accurately observed, the bubbles are efficiently eliminated by utilizing the multi-energy-field coupling effect of a flow field-sound field, and high-precision and low-damage micromachining of a plasma induced by an ultrashort pulse laser is realized.

Description

technical field [0001] The invention belongs to the technical field of laser underwater processing in special processing, and more specifically relates to a bubble observation and elimination device and method for laser underwater processing. Background technique [0002] In the field of aerospace, ultra-high temperature ceramic composite materials are commonly used materials for manufacturing hypersonic aircraft parts. They have high strength, high temperature resistance, and high thermal conductivity, and have broad application prospects. Traditional processing methods are difficult to process. [0003] Ultrashort pulse laser underwater processing focuses picosecond or femtosecond laser into the liquid medium, induces high-temperature plasma, and performs microprocessing on the surface of the material through the thermal and mechanical energy of the plasma. Due to its small pulse width, heat accumulation The phenomenon is not obvious, and the heat-affected zone of the wor...

AI Technical Summary

Problems solved by technology

[0004] Ultrashort pulse laser underwater processing can be used to process ultra-high temperature ceramic composite materials. However, due to the high temperature plasma, the liquid medium or molten material in the processing area will rapidly heat up and vaporize, resulting in a large number of bubbles.

The movement of the bubbles along the direction of the laser light path will cause the laser to defocus, resulting in unstable processing and uneven width and depth of the processed microstructure. At the same time, dynamic behaviors such as expansion, contraction, and rupture of the bubbles near the processing area will cause changes in the flow field. And accompanied by strong shock waves acting on the processed surface, increasing the surface roughness and significantly reducing the quality of the surface

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