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3D printing photosensitive resin based on DLP type photocuring and preparation method thereof

A 3D printing and photosensitive resin technology, applied in the direction of additive processing, etc., can solve the problems of low printing accuracy, insufficient toughness, and high printing cost

Inactive Publication Date: 2021-07-30
DONGGUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since both DLP-type 3D printing technology and SLA-type 3D printing technology use liquid photosensitive resin as the printing material, although the printing precision is extremely high, the printing cost is relatively expensive. expensive to manufacture
At present, the cured 3D printing photosensitive resin in China has poor molding effect, high viscosity, low printing accuracy and insufficient toughness.

Method used

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  • 3D printing photosensitive resin based on DLP type photocuring and preparation method thereof
  • 3D printing photosensitive resin based on DLP type photocuring and preparation method thereof

Examples

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preparation example Construction

[0044] In order to obtain the above-mentioned 3D printing photosensitive resin, the present invention also provides a related preparation method, which includes the following steps:

[0045] Prepare modified prepolymer matrix resin;

[0046] Preparation of modified nano silicon dioxide;

[0047] Add the modified nano-silica to the active diluent, and mix it with a high-speed ultrasonic disperser for 0.5h at room temperature to prepare a mixed diluent, store it away from light, and store it for later use;

[0048] Preparation of light-curing 3D printing photosensitive resin: at room temperature, add the modified prepolymer matrix resin, photoinitiator, mixed diluent, and additives to the round bottom flask in sequence according to the mass ratio, and stir with an electric stirrer for 1h-1.5 h to mix evenly, pour it into a container and seal it, then place it in an ultrasonic cleaner and vibrate for 0.5h-1h, take it out and let it stand for defoaming, and then you can get a lig...

Embodiment 1

[0059] The preparation process of the DLP-based light-curing 3D printing photosensitive resin in this embodiment is as follows:

[0060] At room temperature, weigh 35 parts of modified polyurethane acrylate, 5 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 59.5 parts of modified nano-silica and Mixture of reactive diluents (30 parts of trimethylolpropane triacrylate, 24.5 parts of tripropylene glycol diacrylate and 5 parts of modified nano-silica), 0.45 parts of diethylhydroxylamine, 0.05 parts of Deqian Add the 432 leveling agent to the round bottom flask in turn, stir with an electric mixer for 1 hour until the mixture is uniform, pour it into the container and seal it, then place it in an ultrasonic cleaner and shake it for 0.5 hours, take it out and let it stand for defoaming, and then the photocuring product can be obtained. 3D printing photosensitive resin.

Embodiment 2

[0062] The preparation process of the DLP-based light-curing 3D printing photosensitive resin in this embodiment is as follows:

[0063] At room temperature, weigh 40 parts of modified polyurethane acrylate, 6 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 53.4 parts of modified nano-silica and A mixture of reactive diluents (containing 20 parts of pentaerythritol triacrylate, 29.4 parts of tripropylene glycol diacrylate and 4 parts of modified nano-silica), 0.55 parts of diethylhydroxylamine, and 0.05 parts of TEGO410 leveling agent were added in sequence The round-bottomed flask was stirred with an electric stirrer for 1 hour until it was evenly mixed, poured into a container and sealed, then placed in an ultrasonic cleaner and vibrated for 0.5 hours, and then left to defoam after taking it out to obtain the photocurable 3D printing photosensitive resin.

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Abstract

The invention relates to the technical field of photocuring 3D printing, in particular to 3D printing photosensitive resin based on DLP type photocuring and a preparation method thereof. The 3D printing photosensitive resin is prepared from 35 parts to 60 parts of modified prepolymer matrix resin, 25 parts to 45 parts of a reactive diluent, 5 parts to 10 parts of a photoinitiator, 1 part to 5 parts of modified nano silicon dioxide and 0.1 part to 1 part of an auxiliary, wherein the modified prepolymer matrix resin is polyurethane acrylate which is synthesized by modifying isophorone diamine. The preparation method comprises the steps of preparing the modified prepolymer matrix resin, preparing the modified nano silicon dioxide, adding the modified nano silicon dioxide into the reactive diluent, and preparing the photocuring 3D printing photosensitive resin. The preparation method comprises the steps of modifying polyurethane acrylate through isophorone diamine, adding modified nano silicon dioxide into the active diluent, and carrying out ultrasonic blending to obtain the photosensitive resin with moderate viscosity, small shrinkage, high toughness and high strength.

Description

technical field [0001] The invention relates to the technical field of light-curing 3D printing, in particular to a DLP-based light-curing 3D printing photosensitive resin and a preparation method thereof. Background technique [0002] Because 3D printing technology can directly generate parts of any shape from computer graphics data without machining or molds, greatly shorten the product development cycle and improve production efficiency, it is called an important part of the "third industrial revolution". . The DLP digital light processing technology (Digital Light Processing) has the advantages of fast molding speed and high precision, and is suitable for printing small-sized precision casting components such as personalization and a small amount of jewelry. DLP-type 3D printing technology is very similar to SLA-type 3D printing technology. Liquid photosensitive resin is used as the printing material to print objects layer by layer. Support may also be required during p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/00C08F222/14C08F222/20C08K9/04C08K3/36B33Y70/10
CPCB33Y70/10C08F283/008C08K3/36C08K9/04C08K2201/011C08F222/103C08F222/102C08F222/104
Inventor 不公告发明人
Owner DONGGUAN UNIV OF TECH