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Preparation method of high-performance heat-conducting and wave-absorbing composite material
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A composite material and high-performance technology, which is applied in the field of wave-absorbing materials and heat-conducting materials, can solve problems such as low magnetic permeability and no wave-absorbing characteristics, and achieve the effect of improving service life and ensuring accuracy
Inactive Publication Date: 2021-08-03
SHENZHEN HECHANG ELECTROMAGNETIC MATERIALS CO LTD
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Problems solved by technology
However, most of the existing thermal pads have low magnetic permeability and do not have good wave-absorbing properties
Method used
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preparation example Construction
[0026] The invention provides a technical solution: a method for preparing a high-performance heat-conducting and wave-absorbing composite material. The method for preparing the high-performance heat-conducting and wave-absorbing composite material includes the following steps:
[0027] S1. Material screening, preparation of silicone oil, thermally conductive filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, thermally conductive agent, solvent and accelerator;
[0028] S2, preparation of the heat conduction layer, uniformly mixing the binder, heat conduction agent, solvent, curing agent, catalyst and accelerator according to the required weight percentage, and then making the mixture into a single-layer heat conduction material through a casting process;
[0029] S3, preparation of the wave-absorbing layer, uniformly mixing the binder, wave-absorbing agent, solvent, curing agent, catalyst and accelerator according to the required weight percentage, a...
Embodiment 2
[0041] Embodiment 2, a preparation method of a high-performance heat-conducting and wave-absorbing composite material, the preparation method of the high-performance heat-conducting and wave-absorbing composite material includes the following steps:
[0042] S1. Material screening, preparation of silicone oil, thermally conductive filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, thermally conductive agent, solvent and accelerator;
[0043] S2, preparation of the heat conduction layer, uniformly mixing the binder, heat conduction agent, solvent, curing agent, catalyst and accelerator according to the required weight percentage, and then making the mixture into a single-layer heat conduction material through a casting process;
[0044] S3, preparation of the wave-absorbing layer, uniformly mixing the binder, wave-absorbing agent, solvent, curing agent, catalyst and accelerator according to the required weight percentage, and then making the mixture in...
Embodiment 3
[0049] Embodiment 3, the preparation method of the high-performance heat-conducting and wave-absorbing composite material includes the following steps:
[0050] S1. Material screening, preparation of silicone oil, thermally conductive filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, thermally conductive agent, solvent and accelerator;
[0051] S2, preparation of the heat conduction layer, uniformly mixing the binder, heat conduction agent, solvent, curing agent, catalyst and accelerator according to the required weight percentage, and then making the mixture into a single-layer heat conduction material through a casting process;
[0052] S3, preparation of the wave-absorbing layer, uniformly mixing the binder, wave-absorbing agent, solvent, curing agent, catalyst and accelerator according to the required weight percentage, and then making the mixture into a single-layer electromagnetic wave-absorbing material through a casting process;
[0053] S4,...
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Abstract
The invention discloses a preparation method of a high-performance heat-conducting and wave-absorbing composite material, which relates to the technical field of wave-absorbing materials and heat-conducting materials. The preparation method of the high-performance heat-conducting and wave-absorbing composite material comprises the following steps of material screening, heat-conducting layer preparation, wave-absorbing layer preparation, multi-layer preparation, lamination treatment and material testing. The heat-conducting filler is compounded by one or more of aluminum oxide, siliconoxide, zincoxide, magnesium oxide, calcium oxide, aluminum nitride, boronnitride and siliconcarbide. The thickness of a single layer of the heat-conducting type material is 0.08-0.14 MM, the thickness of a single layer of the electromagnetic wave-absorbing type material is 0.08-0.14 MM, the wave absorbing agent comprises stone type ferrites such as Mn-Zn, Ni-Zn, Li-Ti and the like, and the heat-conducting and wave-absorbing composite material is finally obtained through lamination heat treatment of multiple layers of heat-conducting type materials and multiple layers of electromagnetic wave-absorbing type materials. The service life of the heat-conducting and wave-absorbing composite material can be effectively prolonged, and the heat-conducting and wave-absorbing composite material can be adapted to electronic products with different thicknesses.
Description
technical field [0001] The invention relates to the technical field of wave-absorbing materials and heat-conducting materials, in particular to a method for preparing a high-performance heat-conducting wave-absorbing composite material. Background technique [0002] With the development of electronic equipment in the direction of thinning, high-speed operation, high frequency and high integration, heat dissipation problems may occur in any part of electronic equipment, thus affecting the working stability, reliability and service life of electronic equipment, and even Will cause damage to the device. The parts where heat dissipation problems are prone to occur are usually in some chip positions with digital control / power amplification. The use of thermal pads can effectively export or conduct excess heat generated by the equipment to the graphite layer, so that the chip will not overheat and the heat on the surface will flow along the surface. Uniform diffusion in the direc...
Claims
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Application Information
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